LGHK100568NJ [TAIYO YUDEN]
General Purpose Inductor, 0.068uH, 5%, 1 Element, Ferrite-Core, SMD, 0402, CHIP, 0402, ROHS COMPLIANT;型号: | LGHK100568NJ |
厂家: | TAIYO YUDEN (U.S.A.), INC |
描述: | General Purpose Inductor, 0.068uH, 5%, 1 Element, Ferrite-Core, SMD, 0402, CHIP, 0402, ROHS COMPLIANT 测试 射频感应器 电感器 |
文件: | 总20页 (文件大小:1419K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
高周 波積層チップインダクタ
MULTILAYER CHIP INDUCTOR
FOR HIGH FREQUENCY
HK SERIES
0603D
1005D
ꢀꢀꢀ
1608D
2125D
|
|
|
55V125C
*HK0603, HK1005を除く
*Except for HK0603, HK1005
55V125C**
55V85C**
OPERATING TEMP.
|40V85C
40V85C
**保証定格により変わります。
**Operating temperature depends on rated current.
|
特長ꢀFEATURES
・内部導体として比抵抗値 の低いAgを使用し、良好なQ特性と自己共振周
数特性を実現
・積層シート工法による、高生産性、高品質、高インダクタンス値 対応
波
YMultilayer inductor made of advanced ceramics with low-resistivity silver
used as internal conductors provides excellent Q and SRF characteristics.
YDesigned to address surface mount inductor needs for applications above
・モノリシック構造のため、高い信
頼性を有する
100MHz.
YMultilayer block structure ensures outstanding reliability, high productivity
and product quality.
用途ꢀAPPLICATIONS
・携帯電話、PHS、ページャー
・その他の高周 波回路、中間周 波増幅回路
・高周 波帯域でのEMI対策
YPortable telephones, PHS and pagers
YMiscellaneous high-frequency circuits
YEMI countermeasure in high-frequency circuits.
形名表記法ꢀORDERING CODE
1
2
3
4
5
インダクタンス許容差
包装
- T
形式
HK
形状寸法fLPWghmmi
公称インダクタンス hnHi
高周 波積層チップインダクタ
高周 波積層チップインダクタ
High Q バージョン
例
H
M 3L
リールテーピング
0603f0201g
1005f0402g
1608f0603g
2125f0805g
0.6P0.3
1.0P0.5
1.6P0.8
2.0P1.2
3N9
10N
R10
R12
3.9
10
100
120
J
M 5L
HKQ
C
S
M0.2nH
M0.3nH
FRW 小数点
FNWnH としての小数点
1
2
3
4
5
Inductance Tolerances
Packaging
KT
Type
HK
External Dimensionshmmi
Nominal InductancehnHi
Multilayer chip inductors
for high frequency
Multilayer chip inductors
for high frequency
Tape & Reel
0603f0201g
1005f0402g
1608f0603g
2125f0805g
0.6P0.3
1.0P0.5
1.6P0.8
2.0P1.2
Example
H
J
M 3L
M 5L
3N9
10N
R10
R12
3.9
10
HKQ
C
S
M0.2nH
M0.3nH
100
120
High Q Version
*R=decimal point
*N=0.0fnH typeg
220
外形寸法ꢀEXTERNAL DIMENSIONS
HK Type
Type
L
W
T
e
HK0603
f0201g
HK1005
f0402g
HK1608
f0603g
0.6M0.03
0.3M0.03
0.3M0.03
0.15M0.05
f0.024M0.001g f0.012M0.001g
1.00M0.05 0.5M0.05
f0.039M0.002g f0.020M0.002g
1.6M0.15 0.8M0.15
f0.063 0.006g f0.031M0.006g
f0.012M0.001g f0.006M0.002g
0.5M0.05 0.25M0.10
f0.020M0.002g f0.010M0.004g
0.8M0.15 0.3M0.2
f0.031M0.006g f0.012M0.008g
M
J0.3
1.25M0.2
0.85M0.2
J0.2
1.0ꢀꢀ
K0.3
0.5M0.3
2.0ꢀꢀ
K0.1
HK2125
J0.012
f0805g
f
0.079ꢀꢀꢀg f0.049M0.008g
f0.033M0.008g f0.020M0.012g
J0.008
K0.004
f0.039ꢀꢀꢀ
g
K0.012
5
UnitDmmfinchg
概略バリエーションꢀAVAILABLE INDUCTANCE RANGE
Type
HK0603
HK1005
HK1608
HK2125
Range
使用温度範囲 -55~+125℃�
Imax�
使用温度範囲 -55~+125℃ -55~+85℃�
使用温度範囲 -40~+85℃�
Imax�
使用温度範囲 -40~+85℃�
Imax�
Imax�Imax�
[nH]�
1.0�
1.2�
1.5�
1.8�
2.2�
2.7�
3.3�
3.9�
4.7�
5.6�
6.8�
8.2�
10.0�
12.0�
15.0�
18.0�
22.0�
27.0�
33.0�
39.0�
47.0�
56.0�
68.0�
82.0�
100.0�
120.0�
150.0�
180.0�
220.0�
270.0�
330.0�
390.0�
470.0
[mA]�
[mA] [mA]�
[mA]
1N0□�
1N2□�
1N5□�
1N8□�
2N2□�
2N7□�
3N3□�
3N9□�
4N7□�
5N6□�
6N8○�
8N2○�
10N○�
12N○�
[mA]
1N0□�
1N2□�
1N5□�
1N8□�
2N2□�
2N7□�
3N3□�
3N9□�
4N7□�
5N6□�
6N8○�
8N2○�
10N○�
12N○�
15N○�
18N○�
22N○�
27N○�
33N○�
39N○�
47N○�
56N○�
68N○�
82N○�
R10○�
250�
250�
230
1N0□�
1N2□�
1N5□�
1N8□�
2N2□�
2N7□�
3N3□�
3N9□�
4N7□�
5N6□�
6N8○�
8N2○�
10N○�
12N○�
15N○�
18N○�
22N○�
27N○�
33N○�
39N○�
47N○�
56N○�
68N○�
82N○�
R10○�
R12○�
R15○�
R18○�
R22○�
R27○�
900�
900�
850�
700�
700�
650�
550�
500�
500�
430�
430�
380�
340�
330�
320�
310�
300�
300�
250�
250�
230�
220
1N5S�
1N8S�
2N2S�
2N7S�
3N3S�
3N9S�
4N7S�
5N6S�
6N8J�
8N2J�
10NJ�
12NJ�
15NJ�
18NJ�
22NJ�
27NJ�
33NJ�
39NJ�
47NJ�
56NJ�
68NJ�
82NJ�
R10J�
R12J�
R15J�
R18J�
R22J�
R27J�
R33J�
R39J�
R47J
200
180�
170
300
150
100
ꢀ
300
15N○�
18N○�
22N○�
27N○�
33N○�
39N○�
47N○�
56N○�
68N○�
82N○�
R10○�
R12○�
R15○�
R18○�
R22○�
R27○�
R33○�
R39○�
R47○�
300
200
50
40
180
150
200
140�
130�
120�
110
150
Imax[mA]
Inductance
Imax[mA]
Rdcmax[E]
Rdcma[
E]
Imax[mA]
Rdcmax[E]
Imax[mA]
Rdcmax[E]
-55~+125℃ -55~+85℃
1.5nH
10.0nH
100.0nH
230
150
40
0.18
0.63
4.0
300
300
150
850
340
200
0.1
300
300
300
0.1
0.26
1
300
300
300
0.1
0.3
0.9
0.31
1.5
※形名のG、Zにはインダクタンス許容差記号が入ります。±0.3nHfGg、±5%fZg以下の許容差も対応可能ですので、お問い合わせ下さい。
G, Zmark indicates the Inductance tolerance code. The product with tolerance less than ±0.3nHfGg, ±5%fZg is also available. Please contact your
local sales office.
セレクションガイド
Selection Guide
アイテム一覧
Part Numbers
特性図
Electrical Characteristics
梱包
Packaging
信
頼性
使用上の注意
Reliability Data
Precautions
P.12
etc
P.222
P.224
P.258
P.260
P.268
221
アイテム一覧ꢀPART NUMBERS
HK0603
自己共振周 波数
直
流抵抗 定格電流
厚 さ
EHS
(Environmental
Hazardous
Self-resonant
インダクタンス
Inductance
hnHi
LQ測
定周 波数
QfTypicalg
Rated
current
hmAi
max.
Q
min.
DC.Resistance
hEi
Thickness
hmmi
finchg
形名
Ordering code
frequency
[MHz]
min. Typ. max. Typ.
Measuring frequency
周 波数 Frequency[MHz]
[MHz]
Substances)
100 300 500 800 1000
HK 0603 1N0G
HK 0603 1N2G
HK 0603 1N5G
HK 0603 1N8G
HK 0603 2N0G
HK 0603 2N2G
HK 0603 2N4G
HK 0603 2N7G
HK 0603 3N0G
HK 0603 3N3G
HK 0603 3N6G
HK 0603 3N9G
HK 0603 4N3G
HK 0603 4N7G
HK 0603 5N1G
HK 0603 5N6G
HK 0603 6N2Z
HK 0603 6N8Z
HK 0603 7N5Z
HK 0603 8N2Z
HK 0603 9N1Z
HK 0603 10NZ
HK 0603 12NZ
HK 0603 15NZ
HK 0603 18NZ
HK 0603 22NZ
HK 0603 27NZ
HK 0603 33NZ
HK 0603 39NZ
HK 0603 47NZ
HK 0603 56NZ
HK 0603 68NZ
HK 0603 82NZ
HK 0603 R1 0Z
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
1.0M0.3nH ※
1.2M0.3nH ※
1.5M0.3nH ※
1.8M0.3nH ※
2.0M0.3nH ※
2.2M0.3nH ※
2.4M0.3nH ※
2.7M0.3nH ※
3.0M0.3nH ※
3.3M0.3nH ※
3.6M0.3nH ※
3.9M0.3nH ※
4.3M0.3nH ※
4.7M0.3nH ※
5.1M0.3nH ※
5.6M0.3nH ※
6.2M0.3nH ※
6.8M5% ※
7.5M5% ※
8.2M5% ※
9.1M5% ※
10M5% ※
12M5% ※
15M5% ※
18M5% ※
22M5% ※
4
4
4
4
4
4
4
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
4
4
4
4
4
4
4
4
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
6
6
6
6
6
6
6
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
6
6
6
6
6
6
6
6
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
11
11
11
11
11
11
11
11
11
11
10
10
10
10
10
10
10
9
17
16
15
15
15
15
15
15
15
15
15
15
15
15
15
15
14
14
14
14
14
14
14
13
13
13
12
12
12
11
11
11
11
10
22
21
20
20
20
20
20
20
20
20
20
20
19
19
19
19
18
18
18
18
17
17
17
16
16
15
14
14
13
12
11
11
10
9
27 10000 X13000 0.14 0.088
25 10000 X13000 0.14 0.089
23 10000 X13000 0.18 0.11
23 10000 X13000 0.19 0.12
22 10000 X13000 0.20 0.13
22 8800 12500 0.22 0.14
22 8300 11700 0.24 0.15
22 7700 11000 0.25 0.16
22 7200 11000 0.28 0.18
22 6700 9600 0.30 0.19
22 6400 9100 0.30 0.20
22 6000 8600 0.30 0.20
21 5700 8100 0.40 0.22
21 5300 7600 0.40 0.24
21 5000 7100 0.40 0.26
21 4600 6600 0.40 0.27
20 4200 6100 0.44 0.29
20 3900 5600 0.48 0.30
19 3600 5300 0.53 0.34
19 3400 4900 0.55 0.34
18 3200 4600 0.62 0.40
18 2900 4200 0.63 0.41
18 2700 3800 0.7 0.45
250
250
230
200
200
200
200
200
180
180
170
170
150
150
150
150
150
150
150
150
150
150
100
100
100
100
50
0.30M0.03
f0.012M0.001g
17 2300 3300 0.8
0.5
17 2100 3000 0.9 0.57
16 1800 2600 1.2 0.71
15 1800 2600 1.8 1.11
14 1700 2400 2.1 1.33
12 1500 2100 2.4 1.51
11 1300 1800 2.8 1.74
10 1100 1600 3.0 1.85
10 1100 1500 3.0 2.30
27M5% ※
33M5% ※
39M5% ※
47M5% ※
56M5% ※
68M5% ※
82M5% ※
100M5% ※
50
50
50
50
50
50
40
8
6
1000 1400 3.5 2.60
900 1200 4.0 3.00
※形名のG、Zにはインダクタンス許容差記号が入ります。±0.3nHfGg、±5%fZg以下の許容差も対応可能ですので、お問い合わせ下さい。
G, Zmark indicates the Inductance tolerance code. The product with tolerance less than ±0.3nHfGg, ±5%fZg is also available. Please contact your
local sales office.
HK1005
自己共振周 波数
定格電流
直
流抵抗
厚 さ
EHS
(Environmental
Hazardous
Substances)
Self-resonant
LQ測
Rated current
インダクタンス
定周 波数
QfTypicalg
Q
DC.Resistance
hEi
Thickness
形名
frequency
MeasuringhmAi
Inductance
frequency
周
波数 Frequency[MHz]
min.
Ordering code
hmmi
finchg
max.
[MHz]
min. Typ. max. Typ.
hnHi
[MHz]
K55 ~
J125C
K55 ~
J85C
100 300 500 800 1000
1.0
1.2
1.5
1.8
2.0
2.2
2.4
2.7
3.0
3.3
3.6
3.9
4.3
4.7
5.1
5.6
6.2
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
0.3nH
0.3nH
0.3nH
0.3nH
0.3nH
0.3nH
0.3nH
0.3nH
0.3nH
0.3nH
0.3nH
0.3nH
0.3nH
0.3nH
0.3nH
0.3nH
0.3nH
※
※
※
※
※
※
※
※
※
※
※
※
※
※
※
※
※
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
11
11
11
11
11
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
11
11
11
11
11
11
11
11
11
11
10
10
10
12
12
12
12
25
25
24
23
21
18
18
18
18
18
18
18
18
18
18
18
18
18
18
18
18
18
18
18
18
17
17
16
16
16
16
15
14
14
12
17
16
16
14
34
35
33
30
27
25
24
24
24
24
24
24
24
24
24
24
24
23
23
23
23
23
23
23
23
22
21
20
20
19
18
17
16
14
10
17
K
43
44
44
36
34
31
31
31
31
31
31
31
31
31
31
30
30
29
29
29
29
29
29
28
28
26
25
23
23
21
18
18
15
12
K
52 10000 X13000 0.08 0.04 300 900
52 10000 X13000 0.09 0.04 300 900
48 6000 X13000 0.1 0.05 300 850
42 6000 11000 0.12 0.06 300 700
39 6000 10500 0.12 0.06 300 700
36 6000 10000 0.13 0.07 300 700
35 6000 9500 0.13 0.07 300 650
34 6000 9000 0.13 0.08 300 650
35 6000 8500 0.16 0.09 300 600
35 6000 8000 0.16 0.1 300 550
35 5000 7500 0.2 0.11 300 500
35 4000 7000 0.21 0.12 300 500
35 4000 6500 0.2 0.12 300 500
34 4000 6000 0.21 0.12 300 500
34 4000 5800 0.21 0.13 300 450
35 4000 5700 0.23 0.15 300 430
34 3900 5600 0.25 0.16 300 430
32 3900 5500 0.25 0.17 300 430
32 3700 5200 0.25 0.18 300 400
31 3600 4900 0.28 0.21 300 380
31 3400 4500 0.3 0.22 300 360
31 3200 4300 0.31 0.23 300 340
31 2700 3900 0.4 0.28 300 330
30 2300 3500 0.46 0.31 300 320
30 2100 3100 0.55 0.35 300 310
27 1900 2800 0.6 0.42 300 300
26 1600 2300 0.7 0.47 300 300
HK 1005 1N0G
HK 1005 1N2G
HK 1005 1N5G
HK 1005 1N8G
HK 1005 2N0G
HK 1005 2N2G
HK 1005 2N4G
HK 1005 2N7G
HK 1005 3N0G
HK 1005 3N3G
HK 1005 3N6G
HK 1005 3N9G
HK 1005 4N3G
HK 1005 4N7G
HK 1005 5N1G
HK 1005 5N6G
HK 1005 6N2G
HK 1005 6N8Z
HK 1005 7N5Z
HK 1005 8N2Z
HK 1005 9N1Z
HK 1005 10NZ
HK 1005 12NZ
HK 1005 15NZ
HK 1005 18NZ
HK 1005 22NZ
HK 1005 27NZ
HK 1005 33NZ
HK 1005 39NZ
HK 1005 47NZ
HK 1005 56NZ
HK 1005 68NZ
HK 1005 82NZ
HK 1005 R10Z
HK 1005 R12Z
HK 1005 R15Z
HK 1005 R18Z
HK 1005 R22Z
HK 1005 R27Z
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
6.8
M
5%
5%
5%
5%
※
※
0.50M0.05
7.5
8.2
9.1
M
M
M
f0.020M0.002g
※
※
※
※
※
※
※
※
※
※
※
※
※
※
※
※
※
※
※
※
10
12
15
18
22
27
33
39
47
56
68
82
100
120
150
180
220
270
M
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
M
M
M
M
M
M
M
M
M
M
M
22 1300 1900 0.8
0.5 200 250
21 1200 1700 0.9 0.52 200 250
18 1000 1500
16 750 1300
11 750 1200 1.2
1
1
0.58 200 230
0.61 200 220
0.7 180 200
6
600 1100 1.3 0.81 150 200
600 1000 1.5 0.94 150 200
M
5%
5%
5%
5%
5%
5%
K
K
K
K
K
K
M
M
M
M
M
600 800
550 920
500 810
450 700
400 600
1.6
1.1 150 200
K
3.2 2.57 140 200
3.7 2.97 130 200
4.2 3.29 120 200
4.8 3.92 110 200
K
K
K
K
K
※形名のG、Zにはインダクタンス許容差記号が入ります。±0.3nHfGg、±5%fZg以下の許容差も対応可能ですので、お問い合わせ下さい。
G, Zmark indicates the Inductance tolerance code. The product with tolerance less than ±0.3nHfGg, ±5%fZg is also available. Please contact your
local sales office.
222
アイテム一覧ꢀPART NUMBERS
HK1608
EHS
(Environmental
Hazardous
Substances)
自己共振周 波数
直
流抵抗 定格電流
厚 さ
Self-resonant
インダクタンス
Inductance
LQ測
定周 波数
QfTypicalg
Rated
current
hmAi
max.
Q
min.
DC.Resistance
hEi
Thickness
hmmi
形名
Ordering code
frequency
[MHz]
min. Typ.
Measuring frequency
周 波数 Frequency[MHz]
hnHi
[MHz]
100 300 500 800 1000
max. Typ.
finchg
HK 1608 1N 0G
HK 1608 1N 2G
HK 1608 1N 5G
HK 1608 1N 8G
HK 1608 2N 2G
HK 1608 2N 7G
HK 1608 3N 3G
HK 1608 3N 9G
HK 1608 4N 7G
HK 1608 5N 6G
HK 1608 6N 8Z
HK 1608 8N 2Z
HK 1608 10 NZ
HK 1608 12 NZ
HK 1608 15 NZ
HK 1608 18 NZ
HK 1608 22 NZ
HK 1608 27 NZ
HK 1608 33 NZ
HK 1608 39 NZ
HK 1608 47 NZ
HK 1608 56 NZ
HK 1608 68 NZ
HK 1608 82 NZ
HK 1608 R1 0Z
HK 1608 R1 2Z
HK 1608 R1 5Z
HK 1608 R1 8Z
HK 1608 R2 2Z
HK 1608 R2 7Z
HK 1608 R3 3Z
HK 1608 R3 9Z
HK 1608 R4 7Z
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
1.0M0.3nH ※
1.2M0.3nH ※
1.5M0.3nH ※
1.8M0.3nH ※
2.2M0.3nH ※
2.7M0.3nH ※
3.3M0.3nH ※
3.9M0.3nH ※
4.7M0.3nH ※
5.6M0.3nH ※
6.8M5L ※
8.2M5L ※
10M5L ※
12M5L ※
15M5L ※
18M5L ※
22M5L ※
27M5L ※
33M5L ※
39M5L ※
47M5L ※
8
8
8
8
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
50
14
14
14
10
12
13
14
13
13
14
14
14
14
14
15
15
16
16
17
18
17
17
18
18
18
16
13
13
12
14
14
13
13
30
30
26
18
22
24
25
25
25
25
25
26
26
27
28
27
28
29
31
31
28
28
29
28
27
24
19
18
16
15
40
40
34
24
29
32
33
33
33
33
33
34
34
35
37
36
36
37
40
39
34
34
34
33
28
23
16
12
70
70
47
30
37
41
42
42
42
42
43
44
43
45
46
44
44
45
46
44
35
34
30
27
16
90 10000 X13000 0.05 0.015
90 10000 X13000 0.05 0.015
50 6000 X13000 0.10 0.03
34 6000 X13000 0.10 0.06
40 6000 12000 0.10 0.06
45 6000 11000 0.10 0.06
47 6000 9000 0.12 0.06
46 6000 8000 0.14 0.07
47 4000 6500 0.16 0.08
46 4000 5800 0.18 0.09
47 4000 5600 0.22 0.11
48 3500 5200 0.24 0.13
47 3400 4600 0.26 0.16
49 2600 4000 0.28 0.17
51 2300 3400 0.32 0.20
48 2000 3000 0.35 0.21
47 1600 2900 0.40 0.25
46 1400 2200 0.45 0.28
47 1200 1800 0.55 0.35
44 1100 1600 0.60 0.38
34 900 1600 0.70 0.45
31 900 1400 0.75 0.50
22 700 1200 0.85 0.55
600 1100 0.95 0.60
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
150
150
150
150
8
10
10
10
10
10
10
10
12
12
12
12
12
12
12
12
12
12
12
12
12
8
5
0.8M0.15
f0.031M0.006g
56M5L ※
68M5L ※
82M5L ※
100M5L ※
120M5L ※
150M5L ※
180M5L ※
220M5L ※
270M5L ※
330M5L ※
390M5L ※
470M5L ※
600 1000 1.00 0.65
500 800 1.20 0.68
500 800 1.20 0.73
400 700 1.30 0.85
8
8
8
8
8
8
8
50
50
50
50
50
50
50
400 600 1.50 0.95
400 550
350 480
350 410
300 360
1.9 1.34
2.1 1.53
2.3 1.72
2.6 2.04
※形名のG、Zにはインダクタンス許容差記号が入ります。±0.3nHfGg、±5%fZg以下の許容差も対応可能ですので、お問い合わせ下さい。
G, Zmark indicates the Inductance tolerance code. The product with tolerance less than ±0.3nHfGg, ±5%fZg is also available. Please contact your
local sales office.
HK2125
自己共振周 波数
Q
直流抵抗 定格電流
厚 さ
EHS
(Environmental
Hazardous
Self-resonant
LQ測定周 波数
Typical
インダクタンス
Inductance
Q
min.
DC-Resistance Rated
Thickness
hmmi
形名
Ordering code
Frequency
[MHz]
Measuring frequency
周
波数 Frequency[MHz]
hEi
current
hmAi
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
hnHi
[MHz]
Substances)
100 300 500 800 1000 min.ꢀTyp. max. Typ.
finchg
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
1.5M0.3nH
1.8M0.3nH
2.2M0.3nH
2.7M0.3nH
3.3M0.3nH
3.9M0.3nH
4.7M0.3nH
5.6M0.3nH
6.8M5L
8.2M5L
10M5L
10
10
10
12
12
12
12
15
15
15
15
15
15
15
18
18
18
18
18
18
18
18
18
13
13
13
12
12
12
10
10
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
50
21
18
18
19
16
18
18
20
20
21
20
21
22
24
23
23
24
23
23
23
25
24
23
22
22
23
20
20
22
17
17
39
35
33
36
29
33
34
38
39
40
38
39
42
44
43
42
43
41
41
42
42
41
37
33
34
34
23
19
15
12
57
49
46
50
40
46
46
51
52
54
51
52
55
57
55
53
54
50
49
48
45
41
37
29
26
20
61
55
53
56
47
54
55
60
63
63
60
60
63
63
60
58
55
47
43
39
30
68 4000 X6000 0.10 0.02
59 4000 X6000 0.10 0.02
58 4000 X6000 0.10 0.03
60 4000 X6000 0.10 0.03
51 4000 X6000 0.13 0.04
60 4000 X6000 0.15 0.05
60 3500 X6000 0.20 0.05
66 3200 5400 0.23 0.05
69 2800 4200 0.25 0.06
70 2400 3700 0.28 0.07
67 2100 3100 0.30 0.09
67 1900 3000 0.35 0.10
72 1600 2600 0.40 0.11
72 1500 2300 0.45 0.13
69 1400 2100 0.50 0.16
68 1300 1800 0.55 0.17
60 1200 1700 0.60 0.19
47 1000 1400 0.65 0.25
41 900 1200 0.70 0.26
38 800 1100 0.75 0.28
700 900 0.80 0.33
HK 2125 1N5S
HK 2125 1N8S
HK 2125 2N2S
HK 2125 2N7S
HK 2125 3N3S
HK 2125 3N9S
HK 2125 4N7S
HK 2125 5N6S
HK 2125 6N8J
HK 2125 8N2J
HK 2125 10NJ
HK 2125 12NJ
HK 2125 15NJ
HK 2125 18NJ
HK 2125 22NJ
HK 2125 27NJ
HK 2125 33NJ
HK 2125 39NJ
HK 2125 47NJ
HK 2125 56NJ
HK 2125 68NJ
HK 2125 82NJ
HK 2125 R10J
HK 2125 R12J
HK 2125 R15J
HK 2125 R18J
HK 2125 R22J
HK 2125 R27J
HK 2125 R33J
HK 2125 R39J
HK 2125 R47J
0.85M0.2
f0.033M0.008g
12M5L
15M5L
18M5L
22M5L
27M5L
33M5L
39M5L
47M5L
56M5L
68M5L
82M5L
600 800 0.90 0.37
100M5L
120M5L
150M5L
180M5L
220M5L
270M5L
330M5L
390M5L
470M5L
600 800 0.90 0.40
J0.2
1.00
500 700 0.95 0.43
K0.3
50
500 700 1.00 0.46
J0.008
0.039
fꢀꢀ ꢀꢀg
50
400 600 1.10 0.50
K0.012
50
350 550 1.20 0.75
50
300 480 1.30 0.85
50
250 400 1.40 0.90
50
250 400 1.30 0.85
50
200 350 1.50 0.95
223
特性図ꢀELECTRICAL CHARACTERISTICS
Q-周 波数特性例ꢀQ-CharacteristicsfMeasured by HP8719Cg
HK0603
6.8nH
22nH
10nH
47nH
0.01
0.1
1
10
インピーダンス周 波数特性例ꢀImpedance-vs-Frequency characteristicsfMeasured by HP8719Cg
HK0603
6
10
22nH
4
10
10nH
6.8nH
47nH
2
10
0
10
0.01
0.1
1
10
インダクタンス周 波数特性例ꢀInductance-vs-Frequency characteristicsfMeasured by HP8719Cg
HK0603
47nH
22nH
10nH
6.8nH
0.01
0.1
1
10
224
外形寸法ꢀEXTERNAL DIMENSIONS
HKQ Type
Type
HKQ0603
f0201g
L
W
T
e
0.6M0.03
0.3M0.03
0.3M0.03
0.15M0.05
f0.024M0.001g f0.012M0.001g
f0.012M0.001g f0.006M0.002g
UnitDmmfinchg
概略バリエーションꢀAVAILABLE INDUCTANCE RANGE
Type
HKQ0603
Range
使用温度範囲 -55~+125℃�
Imax�
[nH]�
1.0�
1.2�
1.5�
1.8�
2.2�
2.7�
3.3�
3.9�
4.7�
5.6�
6.8�
8.2�
10.0
[mA]�
400
1N0□�
1N2□�
1N5□�
1N8□�
2N2□�
2N7□�
3N3□�
3N9□�
4N7□�
5N6□�
6N8○�
8N2○�
10N○�
350
ꢀ
300�
300�
250�
200�
200�
170�
170�
150�
150
Inductance
Imax[mA]
Rdcmax[E]
1.5nH
10.0nH
100.0nH
350
150
K
0.13
0.83
K
※形名のG、Zにはインダクタンス許容差記号が入ります。±0.3nHfGg、±5%fZg以下の許容差も対応可能ですので、お問い合わせ下さい。
G, Zmark indicates the Inductance tolerance code. The product with tolerance less than ±0.3nHfGg, ±5%fZg is also available. Please contact your
local sales office.
アイテム一覧ꢀPART NUMBERS
HKQ0603
自己共振周 波数
直
流抵抗 定格電流
厚 さ
EHS
(Environmental
Hazardous
インダクタンス
Inductance
hnHi
LQ測
定周 波数
QfTypicalg
Self-resonant
Rated
current
hmAi
max.
Q
min.
DC.Resistance
hEi
Thickness
hmmi
形名
Ordering code
frequency
[MHz]
min. Typ. max. Typ.
Measuring frequency
周
波数 Frequency[MHz]
[MHz]
Substances)
100 300 500 800 1000
finchg
HKQ 0603 1N0G
HKQ 0603 1N2G
HKQ 0603 1N5G
HKQ 0603 1N8G
HKQ 0603 2N2G
HKQ 0603 2N7G
HKQ 0603 3N3G
HKQ 0603 3N9G
HKQ 0603 4N7G
HKQ 0603 5N6G
HKQ 0603 6N8Z
HKQ 0603 8N2Z
HKQ 0603 10NZ
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
1.0M0.3nH ※
1.2M0.3nH ※
1.5M0.3nH ※
1.8M0.3nH ※
2.2M0.3nH ※
2.7M0.3nH ※
3.3M0.3nH ※
3.9M0.3nH ※
4.7M0.3nH ※
5.6M0.3nH ※
6.8M5% ※
4
4
4
4
4
5
5
5
5
5
5
5
5
100
100
100
100
100
100
100
100
100
100
100
100
100
7
7
7
7
7
7
7
7
7
7
7
7
7
14
13
13
13
12
12
12
12
12
12
12
12
12
19
18
17
17
17
16
16
16
16
16
16
16
16
26
25
23
23
22
22
22
22
21
21
21
21
21
31 10000 X13000 0.10 0.04
29 10000 X13000 0.13 0.08
26 10000 X13000 0.13 0.07
26 9500 X13000 0.13 0.08
25 9000 13000 0.19 0.12
24 7700 11000 0.19 0.11
24 7000 10000 0.27 0.17
24 7000 10000 0.44 0.27
24 5500 8000 0.44 0.22
24 5500 8000 0.55 0.35
24 5000 7500 0.61 0.38
23 4500 6500 0.72 0.45
23 4000 6000 0.83 0.52
400
350
350
350
300
300
250
200
200
170
170
150
150
0.30M0.03
f0.012M0.001g
8.2M5% ※
10M5% ※
※形名のG、Zにはインダクタンス許容差記号が入ります。±0.3nHfGg、±5%fZg以下の許容差も対応可能ですので、お問い合わせ下さい。
G, Zmark indicates the Inductance tolerance code. The product with tolerance less than ±0.3nHfGg, ±5%fZg is also available. Please contact your
local sales office.
226
特性図ꢀELECTRICAL CHARACTERISTICS
Q-周 波数特性例ꢀQ-CharacteristicsfMeasured by HP8719Cg
HKQ0603
50
45
2.2nH
40
35
30
10nH
25
20
15
10
5
0
0.01
0.1
1
10
5
インピーダンス周 波数特性例ꢀImpedance-vs-Frequency characteristicsfMeasured by HP8719Cg
HKQ0603
4
10
10nH
2
10
2.2nH
0
10
0.01
0.1
1
10
インダクタンス周 波数特性例ꢀInductance-vs-Frequency characteristicsfMeasured by HP8719Cg
HKQ0603
10nH
2.2nH
0.01
0.1
1
10
227
梱包ꢀPACKAGING
1最小受注単位数 Minimum Quantity
Fテーピング梱包ꢀTape & Reel Packaging
2テーピング材質ꢀTaping material
製品厚
み
標準数量[pcs]
形ꢀꢀ式
Type
Thickness
[mm]
finchg
0.8
Standard Quantity
紙テープ
エンボステープ
Paper Tape Embossed Tape
CK1608f0603g
CK2125f0805g
4000
4000
E
E
E
f0.031g
0.85
f0.033g
1.25
2000
4000
E
f0.049g
0.8
CKP3216f1206g
LK1005f0402g
LK1608f0603g
E
f0.031g
0.5
10000
4000
4000
E
f0.020g
0.8
E
f0.031g
0.85
E
f0.033g
1.25
LK2125f0805g
2000
E
C K
1 6 0 8
2 1 2 5
1 0 0 5
1 6 0 8
2 1 2 5
0 6 0 3
0 6 0 3
1 0 0 5
1 6 0 8
0 6 0 3
1 0 0 5
1 6 0 8
2 1 2 5
2 0 1 0
1 0 0 5
1 6 0 8
2 1 2 5
f0.049g
0.3
C K
L K
L K
HKQ0603f0201g
HK0603f0201g
HK1005f0402g
HK1608f0603g
15000
15000
10000
4000
E
L K
f0.012g
0.3
H K Q
H K
E
H K
f0.012g
0.5
H K
B K
E
B K
f0.020g
0.8
B K
B K
E
B K
f0.031g
0.85
B K P
B K P
B K P
4000
3000
E
f0.033g
1.0
HK2125f0805g
E
f0.039g
0.3
BK0603f0201g
BK1005f0402g
BK1608f0603g
15000
10000
4000
4000
E
f0.012g
0.5
E
f0.020g
0.8
E
f0.031g
0.85
E
f0.033g
1.25
BK2125f0805g
2000
E
f0.049g
0.45
BK2010f0804g
BK3216f1206g
BKP1005f0402g
BKP1608f0603g
BKP2125f0805g
4000
E
f0.018g
0.8
4000
E
f0.031g
0.5
10000
4000
4000
f0.020g
0.8
E
C K
C K P
L K
2 1 2 5
3 2 1 6
2 1 2 5
2 1 2 5
2 1 2 5
3 2 1 6
f0.031g
0.85
E
f0.033g
H K
B K
B K
258
梱包ꢀPACKAGING
3テーピング寸法ꢀTaping Dimensions
チップ挿入部
挿入ピッチ テープ厚 みmax.
製品厚
み
形ꢀꢀ式
Chip cavity
Insertion Pitch
F
Tape Thickness
Thickness
Paper tape (0.315 inches wide)
Y紙テープ(8mm幅)
Type
hmmi
A
B
K
T
1.25
f0.049g
0.8
1.5M0.2
2.3M0.2
4.0M0.1
2.0
0.3
CK2125f0805g
CKP3216f1206g
LK2125f0805g
f0.059M0.008g
1.9M0.1
f0.091M0.008g
3.5M0.1
f0.157M0.004g
4.0M0.1
f0.079g f0.012g
1.4 0.3
f0.055g f0.012g
2.0 0.3
f0.031g
1.25
f0.075M0.004g
1.5M0.2
f0.138M0.004g
2.3M0.2
f0.157M0.004g
4.0M0.1
f0.049g
0.85
f0.059M0.008g
f0.091M0.008g
f0.157M0.004g
f0.079g f0.012g
5
1.5
f0.033g
1.0
1.5M0.2
2.3M0.2
4.0M0.1
f0.059g
2.0
0.3
HK2125f0805g
f0.059M0.008g
f0.091M0.008g
f0.157M0.004g
f0.012g
f0.039g
1.25
f0.079g
2.0
Unit : mm (inch)
1.5M0.2
f0.059M0.008g
1.9M0.1
2.3M0.2
f0.091M0.008g
3.5M0.1
4.0M0.1
0.3
BK2125f0805g
BK3216f1206g
製品厚
み
チップ挿入部
挿入ピッチ テープ厚
み
f0.049g
0.8
f0.157M0.004g f0.079g f0.012g
形ꢀꢀ式
Thickness
hmmi
0.8
Chip cavity
Insertion Pitch Tape Thickness
4.0M0.1
1.4
0.3
Type
A
B
F
T
f0.031g
f0.075M0.004g
f0.138M0.004g
f0.157M0.004g
f0.055g f0.012g
1.0M0.2
1.8M0.2
4.0M0.1
1.1max
CK1608f0603g
CK2125f0805g
LK1005f0402g
LK1608f0603g
LK2125f0805g
HKQ0603(0201)
HK0603(0201)
HK1005f0402g
HK1608f0603g
BK0603f0201g
BK1005f0402g
BK1608f0603g
BK2125f0805g
BK2010f0804g
f0.031g
0.85
f0.033g
0.5
f0.039M0.008g f0.071M0.008g f0.157M0.004g f0.043maxg
4リーダー部・空部 LEADER AND BLANK PORTION
1.5M0.2
2.3M0.2
4.0M0.1
1.1max
f0.059M0.008g f0.091M0.008g f0.157M0.004g f0.043maxg
0.65M0.1 1.15M0.1 2.0M0.05 0.8max
f0.026M0.004g f0.045M0.004g f0.079M0.002g f0.031maxg
f0.020g
0.8
1.0M0.2
1.8M0.2
4.0M0.1
1.1max
f0.031g
0.85
f0.033g
0.3
f0.039M0.008g f0.071M0.008g f0.157M0.004g f0.043maxg
1.5M0.2
2.3M0.2
4.0M0.1
1.1max
f0.059M0.008g f0.091M0.008g f0.157M0.004g f0.043maxg
0.40M0.06 0.70M0.06 2.0M0.05 0.45max
f0.016M0.002g f0.028M0.002g f0.079M0.002g f0.018maxg
0.40M0.06 0.70M0.06 2.0M0.05 0.45max
f0.016M0.002g f0.028M0.002g f0.079M0.002g f0.018maxg
0.65M0.1 1.15M0.1 2.0M0.05 0.8max
f0.026M0.004g f0.045M0.004g f0.079M0.002g f0.031maxg
160mm以上
6.3inches or more
100mm以上
f3.94inches or moreg
f
g
f0.012g
0.3
引き出し方向
Direction of tape feed
400mm以上
f15.7inches or moreg
f0.012g
0.5
5リール寸法 Reel Size
f0.020g
0.8
1.0M0.2
1.8M0.2
4.0M0.1
1.1max
f0.031g
0.3
f0.039M0.008g f0.071M0.008g f0.157M0.004g
f0.043maxg
2.0M0.5
f0.079M0.031g
0.40M0.06 0.70M0.06 2.0M0.05 0.45max
f0.016M0.002g f0.028M0.002g f0.079M0.002g f0.018maxg
0.65M0.1 1.15M0.1 2.0M0.05 0.8max
B13.0M0.2
fB0.512M0.020g
f0.012g
0.5
f0.020g
0.8
f0.026M0.004g f0.045M0.004g f0.079M0.002g
f0.031maxg
1.0M0.2
1.8M0.2
4.0M0.1
1.1max
f0.031g
0.85
f0.033g
0.45
f0.018g
0.5
f0.039M0.008g f0.071M0.008g f0.157M0.004g f0.043maxg
4.0M0.1
1.1max
1.5M0.2
2.3M0.2
f0.059M0.008g f0.091M0.008g f0.157M0.004g f0.043maxg
1.2M0.1
2.17M0.1 4.0M0.1 0.80max
f0.047M0.004g
f0.085M0.004g f0.157M0.004g f0.031maxg
0.65M0.1 1.15M0.1 2.0M0.05 0.8max
BKP1005f0402g
BKP1608f0603g
BKP2125f0805g
f0.020g
0.8
f0.026M0.004g f0.045M0.004g f0.079M0.002g
f0.031maxg
1.0M0.2
f0.039M0.008g
1.5M0.2
1.8M0.2
4.0M0.1
1.1max
f0.031g
0.85
f0.033g
f0.071M0.008g f0.157M0.004g f0.043maxg
2.3M0.2
4.0M0.1
1.1max
f0.059M0.008g
f0.091M0.008g f0.157M0.004g f0.043maxg
6トップテープ強度ꢀTop tape strength
トップテープの剥離力は、下図矢印方向にて0.1~0.7Nとなります。
The top tape requires a peel-off force of 0.1V0.7N in the direction of
the arrow as illustrated below.
Embossed Tape (0.312 inches wide)
Yエンボステープ(8mm幅)
Unit : mm (inch)
259
1/4
RELIABILITY DATA
Multilayer chip inductors and beads
Specified Value
ARRAY
Test Methods and Remarks
Item
BK0603 BK1005 BK1608 BK2125
BKP1005 BKP1608 BKP2125 CK1608 CK2125 CKP3216 LK1005 LK1608 LK2125 HKQ0603 HK0603 HK1005 HK1608 HK2125
BK2010 BK3216
1.Operating
K55VJ85C
K55VJ85C
K55VJ125C
K55VJ125C
K40VJ85C
K40VJ85C
K55VJ125C
K55VJ125C
K40VJ85C
K40VJ85C
Temperature
Range
2.Storage Tem-
perature Range
3.Rated Current
5
100V
150V
150V
200V
100mA 100V
1.0A
1.0V
3.0A
DC
2.0V
4.0A
DC
40V
100mA 500mA 1.1A
DC DC DC
60V
0.7V
10V
25mA
DC
1V
5V
300mA 400mA 250mA 300mA 300mA DC
DC DC DC DC DC
150V
40V
110V
150V
300mA
500mA 1000mA 1500mA 1200mA DC
200mA DC
50mA
DC
DC
DC
DC
DC
DC
BK0603 Series:
4.Impedance
10V
600E
10V
22V
15V
5V
68V
120E
33V
390E
M25L
33V
220E
M25L
Measuring frequency: 100M1MHz
Measuring equipment: HP4291A
Measuring jig: 16193A
1000E 2500E 2500E 600E
1000E M25L
M25L M25L
M25L M25L M25L M25L
BK1005 Series:
BKP1005 Series:
Measuring frequency: 100M1MHz
Measuring equipment: HP4291A
Measuring jig: 16192A, 16193A
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BK1608, 2125 Series:
BKP1608, 2125 Series:
Measuring frequency: 100M1MHz
Measuring equipment: HP4291A, HP4195A
Measuring jig: 16092A or 16192A (HW)
BK2010, 3216 Series:
Measuring frequency: 100M1MHz
Measuring equipment: HP4291A, HP4195A
Measuring jig: 16192A
5.Inductance
2.2V
0.1V
1.0V
0.12V 0.047V 0.047V 1.0V5.6nH 1.0V6.2nH 1.0V6.2nH 1.0V5.6nH 1.0V5.6nH
CK Series:
10.0AH 10.0AH 4.7AH 2.2AH 33.0AH 33.0AH DM0.3nH DM0.3nH DM0.3nH DM0.3nH DM0.3nH
DM20L DM20L DM20L DM10L DM20L DM20L 6.8V10nH 6.8V100nH 6.8V270nH 6.8V470nH 6.8V470nH
Measuring frequency: 2 to 4MHz (CK1608)
Measuring frequency: 2 to 25MHz (CK2125)
Measuring frequency: 1MHz (CKP3216)
DM5L
DM5L
DM5L
DM5L
DM5L
at DC
200mA
0.4V
0.10V 0.10V
12.0AH 12.0AH
DM10L DM10L
LK Series:
Measuring frequency: 10 to 25MHz (LK1005)
Measuring frequency: 1 to 50MHz (LK1608)
Measuring frequency: 0.4 to 50MHz (LK2125)
Measuring equipment, jig:
1.8AH
min.
HP4194J16085BJ16092A (or its equivalent)
HP4195J41951J16092A (or its equivalent)
HP4294J16192A
HP4291AJ16193A (LK1005)
HP4285AJ42841AJ42842CJ
42851-61100 (CKP3216)
BB
Measuring current:
1mA rms (0.047 to 4.7AH)
0.1mA rms (5.6 to 33AH)
HK Series:
Measuring frequency:
100MHz (HKQ0603,HK0603, HK1005)
Measuring frequency:
50/100MHz (HK1608, HK2125)
Measuring equipment, jig:
HP4291AJ16197A (HKQ0603,HK0603)
HP4291AJ16193A (HK1005)
HP4291A (or its equivalent)J16092AJ
in-house made jig (HK1608, 2125)
* Definition of rated current : In the CK and BK Series, the rated current is the value of current at which the temperature of the element is increased within 20C.
In the BK Series P type and CK Series P type, the rated current is the value of current at which the temperature of the element is increased within 40C.
In the LK and HK Series, the rated current is either the DC value at which the internal L value is decreased within 5% with the application of DC bias, or the value of
current at which the temperature of the element is increased within 20C.
261
2/4
RELIABILITY DATA
Multilayer chip inductors and beads
Specified
Value
ARRAY
Test Methods and Remarks
Item
BK0603 BK1005 BK1608 BK2125
BKP1005 BKP1608 BKP2125 CK1608 CK2125 CKP3216 LK1005 LK1608 LK2125 HKQ0603 HK0603 HK1005 HK1608 HK2125
BK2010 BK3216
6.Q
20
15V20
10V20 10V35 15V50 4V5
min. min. min. min.
4V5
8min. 8V12 10V18 CKSeries:
min.
min.
min.
min.
min.
Measuring frequency: 2 to 4 MHz (CK1608)
Measuring frequency: 2 to 25 MHz (CK2125)
LK Series:
5
Measuring frequency: 10 to 25 MHz (LK1005)
Measuring frequency: 1 to 50 MHz (LK1608)
Measuring frequency: 0.4 to 50MHz (LK2125)
Measuring equipment, jig:
HP4194A +16085B +16092A (or its equivalent)
HP4195A + 41951 + 16092A (or its equivalent)
HP4294A + 16192A
HP4291A + 16193A (LK1005)
Measuring current:
BB
BB
1mA rms (0.047 to 4.7AH)
0.1mA rms (5.6 to 33AH)
HK Series:
Measuring frequency:
100MHz (HKQ0603,HK0603, HK1005)
Measuring frequency:
50 / 100MHz (HK1608, 2125)
Measuring equipment, jig:
(
HP4291A + 16197A HKQ0603,HK0603)
HP4291A + 16193A HK1005)
(
HP4195A + 16092A + in-house made jig
(HK1608, 2125)
7.DC Resistance
0.075V 0.05V 0.05V 0.05V 0.10V 0.15V 0.140E 0.025V 0.020V 0.30V 0.16V 0.11V 0.7V 0.3V 0.20V 0.10V 0.14V 0.08V 0.05V 0.10V
1.50E 0.80E 1.10E 0.75E 0.90E 0.80E max. 0.140E 0.050E 0.90E 0.65E 0.20E 1.70E 2.95E 1.25E 0.83E 4.0E 4.8E 2.6E 1.5E
max. max. max. max. max. max.
max. max.
(M
30
L
) max. max. max. max. max. max. max. max. max. max.
Measuring equipment:
VOACK7412 (made by Iwasaki Tsushinki)
VOACK7512 (made by Iwasaki Tsushinki)
17V
33MHz 235MHz
min. min.
24V
40V
9V
13V
4000V 900V
400V
300V
200V
LK Series:
8.Self Resonance
Frequency(SRF)
180MHz 260MHz 320MHz 10000MHz 10000MHz 10000MHz 10000MHz 4000MHz Measuring equipment: HP4195A
min.
min.
min.
min.
min.
min.
min.
min.
Measuring jig: 41951 + 16092A
(or its equivalent)
BB
BB
HK Series:
Measuring equipment: HP8719C
YHP8753DfHK2125g
9.Temperature
Characteristic
HK Series:
Inductance change:
Temperature range: -30 to +85C
Reference temperature: +20C
WithinM10%
BB
BB
No mechanical damage.
10. Resistance to
Flexure of
Warp: 2mm
Testing board: glass epoxy-resin substrate
Thickness: 0.8mm
Substrate
263
3/4
RELIABILITY DATA
Multilayer chip inductors and beads
Specified Value
ARRAY
Test Methods and Remarks
Item
BK0603 BK1005 BK1608 BK2125
BKP1005 BKP1608 BKP2125 CK1608 CK2125 CKP3216 LK1005 LK1608 LK2125 HKQ0603 HK0603 HK1005 HK1608 HK2125
BK2010 BK3216
11.Solderability
At least 75% of terminal electrode is covered by new solder.
At least 75% of terminal electrode is covered by new solder.
Solder temperature: 230M5C
Duration: 4M1 sec.
12.Resistance to
Soldering
Appearance: No significant abnormality
Solder temperature: 260M5C
No mechanical
damage.
No mechanical
damage.
No mechanical
damage.
Impedance change: WithinM30%
Duration: 10M0.5 sec.
5
Preheating temperature: 150 to 180C
Preheating time: 3 min.
Remaining terminal Remaining terminal Remaining terminal
electrode: 70% min. electrode: 70% min. electrode: 70% min.
Inductance change
R10V4R7:
Inductance change Inductance change:
Flux: Immersion into methanol solution with
colophony for 3 to 5 sec.
47NV4R7:
WithinM10%
5R6V330:
WithinM5%
WithinM10%
6R8V100:
Recovery: 2 to 3 hrs of recovery under the stan-
dard condition after the test. (See Note 1)
WithinM15%
CKP3216:
WithinM15%
WithinM30%
13.Thermal Shock
Appearance: No significant abnormality
No mechanical
damage.
No mechanical damage.
No
mechanical
damage.
No
mechanical
damage.
Conditions for 1 cycle
Impedance change: Within M30%
Inductance change: WithinM10%
step 1: Minimum operating temperature
Inductance change: Qchange: WithinM20%
ꢀ
J0/K3C 30M3 min.
Inductance
change:
Within
Inductance
change:
Within
step 2: Room temperature 2 to 3min.
WithinM10%
Qchange:
step 3: Minimum operating temperature
M20%
M30%
ꢀ
J0/K3C 30M3 min.
WithinM30%
step 4: Room temperature 2 to 3min.
Number of cycles: 5
Qchange:
Within
M30%
Recovery: 2 to 3 hrs of recovery under the stan-
dard condition after the test. (See Note 1)
(Note 1) When there are questions concerning
mesurement resultDmeasurement shall be made
after 48M2 hrs of recovery under
the standard condition.
265
4/4
RELIABILITY DATA
Multilayer chip inductors and beads
Specified Value
ARRAY
Test Methods and Remarks
Item
BK0603 BK1005 BK1608 BK2125
BKP1005 BKP1608 BKP2125 CK1608 CK2125 CKP3216 LK1005 LK1608 LK2125 HKQ0603 HK0603 HK1005 HK1608 HK2125
BK2010 BK3216
14. Damp Heat
Appearance: No significant abnormality
No
mechanica
damage.
No
No mechanica
No
No mechanica damage.
mechanica Inductance change:
damage. WithinM10%
BK Series:
mechanica damage.
damage.
fSteady stateg
Temperature: 40M2C
Impedance change: Within M30%
Inductance change:
Inductance WithinM10%
Humidity: 90 to 95%RH
+24
Inductance
change:
Within
Inductance Q change: WithinM20%
Duration: 500K hrs
0
change:
Within
M30%
change:
Within
M10%
Q change:
WithinM30%
Recovery: 2 to 3 hrs of recovery under the
standard condition after the removal
from test chamber.fSee Note1g
M20%
5
Q change:
Within
Q change:
Within
M30%
M30%
LK, CK, HK Series:
Temperature: 40M2C (LK, CK Series)
60M2C (HK Series)
Humidity: 90 to 95%RH
Duration: 500M12 hours
Recovery: 2 to 3 hrs of recovery under the
standard condition after the removal
from test chamber. fSee Note1g
BK Series:
15.Loading under
Damp Heat
No
mechanica
damage.
No
No
No
No
No mechanica damage.
No mechanical damage, Inductance change
mechanica mechanica mechanica mechanica Inductance change:
damage. damage. damage. damage.
Temperature: 40M2C (LK Series)
withinM30L
WithinM10%
Humidity: 90 to 95%RH
+24
Inductance
change:
Within
Inductance Inductance Inductance Inductance Q change: WithinM20%
Duration: 500K hrs
0
change:
Within
M30%
change:
Within
M10%
change:
0.047 to
12.0AH:
Within
change:
Within
M10%
Applied current: Rated current
M20%
Recovery: 2 to 3 hrs of recovery under the
standard condition after the removal
from test chamber.fSee Note1g
Q change:
Within
M30%
Q change: M10%
Q change:
Within
M30%
Within
15.0 to
33.0AH:
Within
M15%
M30%
LK, CK, HK Series:
Q change:
Within
M30%
Temperature: 40M2C (LK, CK Series)
60M2C (HK Series)
Humidity: 90 to 95%RH
Duration: 500M12 hrs
Applied current: Rated current
Recovery: 2 to 3 hrs of recovery under the
standard condition after the removal
from test chamber.
fSee Note1g
16.Loading at
High
Appearance: No significant abnormality
No
mechanica
damage.
No
No
No
No
No mechanica damage.
BK Series:
Temperature: 125M3C
mechanica mechanica mechanica mechanica Inductance change:
damage. damage. damage. damage.
Impedance change: Within M30%
WithinM10%
Temperature
Applied current: Rated current
+24
Inductance
change:
Within
Inductance Inductance Inductance Inductance Q change: WithinM20%
Duration: 500K hrs
0
change:
Within
M30%
change:
Within
M10%
change:
0.047 to
12.0AH:
Within
change:
Within
M10%
Recovery: 2 to 3 hrs of recovery under the
standard condition after the removal
from test chamber.fSee Note1g
M20%
Q change:
Within
M30%
Q change: M10%
Q change:
Within
M30%
Within
15.0 to
33.0AH:
Within
M15%
M30%
LK, CK, HK Series, BK Series P type:
Temperature: 85M2C (LK, CK Series)
: 85M3C (BK Series P type)
Q change:
Within
M30%
: 85M2C (HK 1608, 2125)
: 85M2C (HK 1005 operating
temperature range K55 to J85C)
: 125M2C (HKQ 0603,HK 0603, HK1005)
operating temperature range
K55 to 125C)
J
Applied current: Rated current
Duration: 500M12 hrs
Recovery: 2 to 3 hrs of recovery under the
standard condition after the removal
from test chamber. fSee Note1g
Note on standard condition: "standard condition" referred to herein is defined as follows:
5 to 35C of temperature, 45 to 85% relative humidity, and 86 to 106kPa of air pressure.
When there are questions concerning measurement results:
(Note 1)
measurement shall be made after 48M2 hrs of re-
covery under the standard condition.
In order to provide correlation data, the test shall be conducted under condition of 20M2C of temperature, 60 to 70% relative humidity,
and 86 to 106kPa of air pressure. Unless otherwise specified, all the tests are conducted under the "standard condition."
267
1/7
PRECAUTIONS
Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer ferrite chip beads
Stages
Precautions
Technical considerations
1. Circuit Design
SVerification of operating environment, electrical rating
and performance
1. A malfunction in medical equipment, spacecraft,
nuclear reactors, etc. may cause serious harm to
human life or have severe social ramifications. As
such, any inductors to be used in such equipment may
require higher safety and/or reliability considerations
and should be clearly differentiated from components
used in general purpose applications.
5
SOperating Current (Verification of Rated current)
1. The operating current for inductors must always be
lower than their rated values.
2. Do not apply current in excess of the rated value
because the inductance may be reduced due to the
magnetic saturation effect.
2. PCB Design
SPattern configurations
1. The following diagrams and tables show some examples of recommended
patterns to prevent excessive solder amounts (larger fillets which extend above
the component end terminations). Examples of improper pattern designs are
(Design of Land-patterns)
1. When inductors are mounted on a PCB, the amount of
solder used (size of fillet) can directly affect inductor
performance. Therefore, the following items must be
carefully considered in the design of solder land pat-
terns:
also shown.
(1) Recommended land dimensions for a typical chip inductor land patterns for
PCBs
(1) The amount of solder applied can affect the ability of
chips to withstand mechanical stresses which may lead
to breaking or cracking. Therefore, when designing
land-patterns it is necessary to consider the appropri-
ate size and configuration of the solder pads which in
turn determines the amount of solder necessary to form
the fillets.
Recommended land dimensions for wave-soldering (unit: mm)
Type
1608
1.6
2125
2.0
3216
3.2
L
(2) When more than one part is jointly soldered onto the
same land or pad, the pad must be designed so that
each component's soldering point is separated by sol-
der-resist.
W
0.8
1.25
1.6
A
B
C
0.8V1.0
0.5V0.8
0.6V0.8
1.0V1.4
0.8V1.5
0.9V1.2
1.8V2.5
0.8V1.7
1.2V1.6
Recommended land dimensions for reflow-soldering (unit: mm)
Type
0603
0.6
1005
1.0
1608
1.6
2125
2.0
3216
3.2
L
W
0.3
0.5
0.8
1.25
1.6
A
B
C
0.20V0.30
0.20V0.30
0.25V0.40
0.45V0.55
0.40V0.50
0.45V0.55
0.6V0.8
0.6V0.8
0.6V0.8
0.8V1.2
0.8V1.2
0.9V1.6
1.8V2.5
0.6V1.5
1.2V2.0
Excess solder can affect the ability of chips to withstand mechanical stresses.
Therefore, please take proper precautions when designing land-patterns.
Recommended land
dimension for
Reflow-soldering (unit: mm)
3216
3.2
2010
2.0
L
W
1.6
1.0
a
b
c
d
0.7V0.9 0.5V0.6
0.8V1.0 0.5V0.6
0.4V0.5 0.2V0.3
0.8
0.5
269
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PRECAUTIONS
Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer ferrite chip beads
Stages
2.PCB Design
Precautions
Technical considerations
(2) Examples of good and bad solder application
Not recommended
Recommended
Mixed mounting
of SMD and
leaded compo-
nents
C o m p o n e n t
placement close
to the chassis
5
Hand-soldering
of leaded com-
ponents near
mounted compo-
nents
Horizontal com-
ponent place-
ment
1-1. The following are examples of good and bad inductor layout; SMD inductors
should be located to minimize any possible mechanical stresses from board
warp or deflection.
SPattern configurations
(Inductor layout on panelized [breakaway] PC boards)
1. After inductors have been mounted on the boards, chips
can be subjected to mechanical stresses in subsequent
manufacturing processes (PCB cutting, board inspec-
tion, mounting of additional parts, assembly into the
chassis, wave soldering the reflow soldered boards etc.)
For this reason, planning pattern configurations and
the position of SMD inductors should be carefully per-
formed to minimize stress.
Not recommended
Recommended
Item
Deflection of
the board
1-2. To layout the inductors for the breakaway PC board, it should be noted that
the amount of mechanical stresses given will vary depending on inductor
layout. An example below should be counted for better design.
1-3. When breaking PC boards along their perforations, the amount of mechani-
cal stress on the inductors can vary according to the method used. The
following methods are listed in order from least stressful to most stressful:
push-back, slit, V-grooving, and perforation. Thus, any ideal SMD inductor
layout must also consider the PCB splitting procedure.
271
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PRECAUTIONS
Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer ferrite chip beads
Stages
Precautions
Technical considerations
1. If the lower limit of the pick-up nozzle is low, too much force may be imposed
on the inductors, causing damage. To avoid this, the following points should
be considered before lowering the pick-up nozzle:
3.Considerations for
automatic placement
SAdjustment of mounting machine
1. Excessive impact load should not be imposed on the
inductors when mounting onto the PC boards.
2. The maintenance and inspection of the mounter should
be conducted periodically.
(1)The lower limit of the pick-up nozzle should be adjusted to the surface level of
the PC board after correcting for deflection of the board.
(2)The pick-up pressure should be adjusted between 1 and 3 N static loads.
(3)To reduce the amount of deflection of the board caused by impact of the pick-
up nozzle, supporting pins or back-up pins should be used under the PC board.
The following diagrams show some typical examples of good pick-up nozzle
placement:
5
Improper method
Proper method
Single-sided mounting
Double-sided
mounting
2. As the alignment pin wears out, adjustment of the nozzle height can cause
chipping or cracking of the inductors because of mechanical impact on the
inductors. To avoid this, the monitoring of the width between the alignment pin
in the stopped position, and maintenance, inspection and replacement of the
pin should be conducted periodically.
SSelection of Adhesives
1. Some adhesives may cause reduced insulation resistance. The difference
between the shrinkage percentage of the adhesive and that of the inductors
may result in stresses on the inductors and lead to cracking. Moreover, too
little or too much adhesive applied to the board may adversely affect compo-
nent placement, so the following precautions should be noted in the applica-
tion of adhesives.
1. Mounting inductors with adhesives in preliminary as-
sembly, before the soldering stage, may lead to de-
graded inductor characteristics unless the following
factors are appropriately checked; the size of land pat-
terns, type of adhesive, amount applied, hardening tem-
perature and hardening period. Therefore, it is impera-
tive to consult the manufacturer of the adhesives on
proper usage and amounts of adhesive to use.
(1)Required adhesive characteristics
a. The adhesive should be strong enough to hold parts on the board during the
mounting & solder process.
b. The adhesive should have sufficient strength at high temperatures.
c. The adhesive should have good coating and thickness consistency.
d. The adhesive should be used during its prescribed shelf life.
e. The adhesive should harden rapidly
f. The adhesive must not be contaminated.
g. The adhesive should have excellent insulation characteristics.
h. The adhesive should not be toxic and have no emission of toxic gasses.
273
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PRECAUTIONS
Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer ferrite chip beads
Stages
Precaution
Technical considerations
3.Considerations for
automatic placement
When using adhesives to mount inductors on a PCB, inappropriate amounts of
adhesive on the board may adversely affect component placement. Too little
adhesive may cause the inductors to fall off the board during the solder process.
Too much adhesive may cause defective soldering due excessive flow of adhe-
sive on to the land or solder pad.
[Recommended conditions]
Figure
0805 case sizes as examples
0.3mm min
5
a
b
c
100 V120 Am
Area with no adhesive
4.Soldering
SSelection of Flux
1-1. When too much halogenated substance (Chlorine, etc.) content is used to
activate the flux, or highly acidic flux is used, an excessive amount of resi-
due after soldering may lead to corrosion of the terminal electrodes or deg-
radation of insulation resistance on the surface of the Inductor.
1-2. Flux is used to increase solderability in flow soldering, but if too much is
applied, a large amount of flux gas may be emitted and may detrimentally
affect solderability. To minimize the amount of flux applied, it is recom-
mended to use a flux-bubbling system.
1. Since flux may have a significant effect on the perfor-
mance of inductors, it is necessary to verify the follow-
ing conditions prior to use;
(1)Flux used should be with less than or equal to 0.1 wt%
(Chlorine conversion method) of halogenated content.
Flux having a strong acidity content should not be ap-
plied.
(2)When soldering inductors on the board, the amount of
flux applied should be controlled at the optimum level.
(3)When using water-soluble flux, special care should be
taken to properly clean the boards.
1-3. Since the residue of water-soluble flux is easily dissolved by water content in
the air, the residue on the surface of Inductor in high humidity conditions
may cause a degradation of insulation resistance and therefore affect the
reliability of the components. The cleaning methods and the capability of the
machines used should also be considered carefully when selecting water-
soluble flux.
SSoldering
Temperature, time, amount of solder, etc. are specified in
accordance with the following recommended conditions.
1-1. Preheating when soldering
Heating: Chip inductor components should be preheated to within 100 to
130C of the soldering. Cooling: The temperature difference between the
components and cleaning process should not be greater than 100 C.
Chip inductors are susceptible to thermal shock when exposed to rapid or
concentrated heating or rapid cooling. Therefore, the soldering process
must be conducted with a great care so as to prevent malfunction of the
components due to excessive thermal shock.
275
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PRECAUTIONS
Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer ferrite chip beads
Stages
4.Soldering
Precautions
Technical considerations
SAnd please contact us about peak temperature when
Recommended conditions for soldering
you use lead-free paste.
[Reflow soldering]
Temperature profile
TemperaturefCg
fPb free solderingg
300
Peak 260C max
10 sec max
200
100
0
Gradually
cooling
Preheating
150C
60 sec min
Heating above 230C
40 sec max
5
※Ceramic chip components should be preheated to
within 100 to 130C of the soldering.
※Assured to be reflow soldering for 2 times.
Caution
1. The ideal condition is to have solder mass (fillet) controlled to 1/2 to 1/3 of
the thickness of the inductor, as shown below:
2. Because excessive dwell times can detrimentally affect solderability, sol-
dering duration should be kept as close to recommended times as pos-
sible.
[Wave soldering]
TemperaturefCg
300
fPb free solderingg
Temperature profile
Peak 260C max
10 sec max
200
100
0
Gradually
cooling
Preheating
150C
120 sec min
※Ceramic chip components should be preheated to
within 100 to 130C of the soldering.
※Assured to be wave soldering for 1 time.
※Except for reflow soldering type.
Caution
1. Make sure the inductors are preheated sufficiently.
2. The temperature difference between the inductor and melted solder should
not be greater than 100 to 130C
3. Cooling after soldering should be as gradual as possible.
4. Wave soldering must not be applied to the inductors designated as for reflow
soldering only.
[Hand soldering]
Temperature profile
TemperaturefCg
fPb free solderingg
400
350C max
3 sec max
300
200
Gradually
cooling
⊿T�
100
0
60 sec min
f※⊿TT190C f3216Type maxg, ⊿TT130C f3225
Type mingg
※It is recommended to use 20W soldering iron and
the tip is 1B or less.
※The soldering iron should not directly touch the
components.
※Assured to be soldering iron for 1 time.
Note: The above profiles are the maximum allowable
soldering condition, therefore these profiles are
not always recommended.
Caution
1. Use a 20W soldering iron with a maximum tip diameter of 1.0 mm.
2. The soldering iron should not directly touch the inductor.
5.Cleaning
SCleaning conditions
1. The use of inappropriate solutions can cause foreign substances such as flux
residue to adhere to the inductor, resulting in a degradation of the inductor's
electrical properties (especially insulation resistance).
1. When cleaning the PC board after the Inductors are all
mounted, select the appropriate cleaning solution ac-
cording to the type of flux used and purpose of the
cleaning (e.g. to remove soldering flux or other materi-
als from the production process.)
277
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PRECAUTIONS
Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer ferrite chip beads
Stages
5.Cleaning
Precautions
Technical considerations
2. Inappropriate cleaning conditions (insufficient or excessive cleaning) may
detrimentally affect the performance of the inductors.
2. Cleaning conditions should be determined after verify-
ing, through a test run, that the cleaning process does
not affect the inductor's characteristics.
(1)Excessive cleaning
In the case of ultrasonic cleaning, too much power output can cause
excessive vibration of the PC board which may lead to the cracking of the
inductor or the soldered portion, or decrease the terminal electrodes' strength.
Thus the following conditions should be carefully checked;
5
Ultrasonic output
Below 20 w/b
Ultrasonic frequency
Below 40 kHz
Ultrasonic washing period 5 min. or less
SApplication of resin coatings, moldings, etc. to the PCB
6. Post cleaning processes
and components.
1. With some type of resins a decomposition gas or chemi-
cal reaction vapor may remain inside the resin during
the hardening period or while left under normal storage
conditions resulting in the deterioration of the inductor's
performance.
2. When a resin's hardening temperature is higher than
the inductor's operating temperature, the stresses gen-
erated by the excess heat may lead to inductor dam-
age or destruction.
3. Stress caused by a resin’s temperature generated ex-
pansion and contraction may damage inductors.
The use of such resins, molding materials etc. is not rec-
ommended.
7. Handling
SBreakaway PC boards (splitting along perforations)
1. When splitting the PC board after mounting inductors
and other components, care is required so as not to
give any stresses of deflection or twisting to the board.
2. Board separation should not be done manually, but by
using the appropriate devices.
SGeneral handling precautions
1. Always wear static control bands to protect against ESD.
2. Keep the inductors away from all magnets and mag-
netic objects.
3. Use non-magnetic tweezers when handling inductors.
4. Any devices used with the inductors (soldering irons,
measuring instruments) should be properly grounded.
5. Keep bare hands and metal products (i.e., metal desk)
away from chip electrodes or conductive areas that lead
to chip electrodes.
6. Keep inductors away from items that generate mag-
netic fields such as speakers or coils.
SMechanical considerations
1. Be careful not to subject the inductors to excessive
mechanical shocks.
(1) If inductors are dropped on the floor or a hard surface
they should not be used.
(2)When handling the mounted boards, be careful that
the mounted components do not come in contact with
or bump against other boards or components.
279
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PRECAUTIONS
Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer ferrite chip beads
Stages
Precautions
Technical considerations
8. Storage conditions
SStorage
1. If the parts are stocked in a high temperature and humidity environment, prob-
lems such as reduced solderability caused by oxidation of terminal electrodes
and deterioration of taping/packaging materials may take place. For this rea-
son, components should be used within 6 months from the time of delivery. If
exceeding the above period, please check solderability before using the in-
ductors
1. To maintain the solderability of terminal electrodes and
to keep the packaging material in good condition, care
must be taken to control temperature and humidity in
the storage area. Humidity should especially be kept
as low as possible.
Recommended conditions
Ambient temperature
Humidity
Below 40 C
5
Below 70% RH
The ambient temperature must be kept below 30 C. Even
under ideal storage conditions inductor electrode solder-
ability decreases as time passes, so inductors should be
used within 6 months from the time of delivery.
*The packaging material should be kept where no chlo-
rine or sulfur exists in the air.
281
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