LGHK100568NJ [TAIYO YUDEN]

General Purpose Inductor, 0.068uH, 5%, 1 Element, Ferrite-Core, SMD, 0402, CHIP, 0402, ROHS COMPLIANT;
LGHK100568NJ
型号: LGHK100568NJ
厂家: TAIYO YUDEN (U.S.A.), INC    TAIYO YUDEN (U.S.A.), INC
描述:

General Purpose Inductor, 0.068uH, 5%, 1 Element, Ferrite-Core, SMD, 0402, CHIP, 0402, ROHS COMPLIANT

测试 射频感应器 电感器
文件: 总20页 (文件大小:1419K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
高周 波積層ダクタ  
MULTILAYER CHIP INDUCTOR  
FOR HIGH FREQUENCY  
HK SERIES  
0603D  
1005D  
ꢀꢀꢀ  
1608D  
2125D  
55V125C  
HK0603, HK1005を除く  
Except for HK0603, HK1005  
55V125C*  
55V85C*  
OPERATING TEMP.  
40V85C  
40V85C  
保証定格により変わります。  
Operating temperature depends on rated current.  
特長ꢀFEATURES  
・内部導体として比抵抗値 の低いAgを使用し、良好なQ特性と自己共振周  
数特性を実現  
・積層シート工法による、高生産性、高品質、高インダクタンス値 対応  
YMultilayer inductor made of advanced ceramics with low-resistivity silver  
used as internal conductors provides excellent Q and SRF characteristics.  
YDesigned to address surface mount inductor needs for applications above  
・モノリシック構造のため、高い信  
頼性を有する  
100MHz.  
YMultilayer block structure ensures outstanding reliability, high productivity  
and product quality.  
用途ꢀAPPLICATIONS  
・携帯電話、PHS、ページャー  
・その他の高周 波回路、中間周 波増幅回路  
・高周 波帯域でのEMI対策  
YPortable telephones, PHS and pagers  
YMiscellaneous high-frequency circuits  
YEMI countermeasure in high-frequency circuits.  
形名表記法ꢀORDERING CODE  
1
2
3
4
5
インダクタンス許容差  
包装  
T  
形式  
HK  
形状寸法fLPWghmmi  
公称インダクタンス hnHi  
高周 波積層チップインダクタ  
高周 波積層チップインダクタ  
High Q バージョン  
H
M 3L  
リールテーピング  
0603f0201g  
1005f0402g  
1608f0603g  
2125f0805g  
0.6P0.3  
1.0P0.5  
1.6P0.8  
2.0P1.2  
3N9  
10N  
R10  
R12  
3.9  
10  
100  
120  
J
M 5L  
HKQ  
C
S
M0.2nH  
M0.3nH  
FRW 小数点  
FNWnH としての小数点  
1
2
3
4
5
Inductance Tolerances  
Packaging  
KT  
Type  
HK  
External Dimensionshmmi  
Nominal InductancehnHi  
Multilayer chip inductors  
for high frequency  
Multilayer chip inductors  
for high frequency  
Tape & Reel  
0603f0201g  
1005f0402g  
1608f0603g  
2125f0805g  
0.6P0.3  
1.0P0.5  
1.6P0.8  
2.0P1.2  
Example  
H
J
M 3L  
M 5L  
3N9  
10N  
R10  
R12  
3.9  
10  
HKQ  
C
S
M0.2nH  
M0.3nH  
100  
120  
High Q Version  
*R=decimal point  
*N=0.0fnH typeg  
220  
外形寸法ꢀEXTERNAL DIMENSIONS  
HK Type  
Type  
L
W
T
e
HK0603  
f0201g  
HK1005  
f0402g  
HK1608  
f0603g  
0.6M0.03  
0.3M0.03  
0.3M0.03  
0.15M0.05  
f0.024M0.001g f0.012M0.001g  
1.00M0.05 0.5M0.05  
f0.039M0.002g f0.020M0.002g  
1.6M0.15 0.8M0.15  
f0.063 0.006g f0.031M0.006g  
f0.012M0.001g f0.006M0.002g  
0.5M0.05 0.25M0.10  
f0.020M0.002g f0.010M0.004g  
0.8M0.15 0.3M0.2  
f0.031M0.006g f0.012M0.008g  
M
J0.3  
1.25M0.2  
0.85M0.2  
J0.2  
1.0ꢀꢀ  
K0.3  
0.5M0.3  
2.0ꢀꢀ  
K0.1  
HK2125  
J0.012  
f0805g  
f
0.079ꢀꢀꢀg f0.049M0.008g  
f0.033M0.008g f0.020M0.012g  
J0.008  
K0.004  
f0.039ꢀꢀꢀ  
g
K0.012  
5
UnitDmmfinchg  
概略バリエーションꢀAVAILABLE INDUCTANCE RANGE  
Type  
HK0603  
HK1005  
HK1608  
HK2125  
Range  
使用温度範囲 -55~+125℃�  
Imax�  
使用温度範囲 -55~+125℃ -55~+85℃�  
使用温度範囲 -40~+85℃�  
Imax�  
使用温度範囲 -40~+85℃�  
Imax�  
ImaxImax�  
[nH]�  
1.0�  
1.2�  
1.5�  
1.8�  
2.2�  
2.7�  
3.3�  
3.9�  
4.7�  
5.6�  
6.8�  
8.2�  
10.0�  
12.0�  
15.0�  
18.0�  
22.0�  
27.0�  
33.0�  
39.0�  
47.0�  
56.0�  
68.0�  
82.0�  
100.0�  
120.0�  
150.0�  
180.0�  
220.0�  
270.0�  
330.0�  
390.0�  
470.0  
[mA]�  
[mA] [mA]�  
[mA]  
1N0□�  
1N2□�  
1N5□�  
1N8□�  
2N2□�  
2N7□�  
3N3□�  
3N9□�  
4N7□�  
5N6□�  
6N8○�  
8N2○�  
10N○�  
12N○�  
[mA]  
1N0□�  
1N2□�  
1N5□�  
1N8□�  
2N2□�  
2N7□�  
3N3□�  
3N9□�  
4N7□�  
5N6□�  
6N8○�  
8N2○�  
10N○�  
12N○�  
15N○�  
18N○�  
22N○�  
27N○�  
33N○�  
39N○�  
47N○�  
56N○�  
68N○�  
82N○�  
R10○�  
250�  
250�  
230  
1N0□�  
1N2□�  
1N5□�  
1N8□�  
2N2□�  
2N7□�  
3N3□�  
3N9□�  
4N7□�  
5N6□�  
6N8○�  
8N2○�  
10N○�  
12N○�  
15N○�  
18N○�  
22N○�  
27N○�  
33N○�  
39N○�  
47N○�  
56N○�  
68N○�  
82N○�  
R10○�  
R12○�  
R15○�  
R18○�  
R22○�  
R27○�  
900�  
900�  
850�  
700�  
700�  
650�  
550�  
500�  
500�  
430�  
430�  
380�  
340�  
330�  
320�  
310�  
300�  
300�  
250�  
250�  
230�  
220  
1N5S�  
1N8S�  
2N2S�  
2N7S�  
3N3S�  
3N9S�  
4N7S�  
5N6S�  
6N8J�  
8N2J�  
10NJ�  
12NJ�  
15NJ�  
18NJ�  
22NJ�  
27NJ�  
33NJ�  
39NJ�  
47NJ�  
56NJ�  
68NJ�  
82NJ�  
R10J�  
R12J�  
R15J�  
R18J�  
R22J�  
R27J�  
R33J�  
R39J�  
R47J  
200  
180�  
170  
300  
150  
100  
300  
15N○�  
18N○�  
22N○�  
27N○�  
33N○�  
39N○�  
47N○�  
56N○�  
68N○�  
82N○�  
R10○�  
R12○�  
R15○�  
R18○�  
R22○�  
R27○�  
R33○�  
R39○�  
R47○�  
300  
200  
50  
40  
180  
150  
200  
140�  
130�  
120�  
110  
150  
Imax[mA]  
Inductance  
Imax[mA]  
Rdcmax[E]  
Rdcma[  
E]  
Imax[mA]  
Rdcmax[E]  
Imax[mA]  
Rdcmax[E]  
55+125℃ -55+85℃  
1.5nH  
10.0nH  
100.0nH  
230  
150  
40  
0.18  
0.63  
4.0  
300  
300  
150  
850  
340  
200  
0.1  
300  
300  
300  
0.1  
0.26  
1
300  
300  
300  
0.1  
0.3  
0.9  
0.31  
1.5  
形名のGZにはインダクタンス許容差記号が入ります±0.3nHfGg±5fZg以下の許容差も対応可能ですので問い合わせ下さい。  
G, Zmark indicates the Inductance tolerance code. The product with tolerance less than ±0.3nHfGg, ±5fZg is also available. Please contact your  
local sales office.  
セレクションガイド  
Selection Guide  
アイテム一覧  
Part Numbers  
特性図  
Electrical Characteristics  
梱包  
Packaging  
頼性  
使用上の注意  
Reliability Data  
Precautions  
P.12  
etc  
P.222  
P.224  
P.258  
P.260  
P.268  
221  
アイテム一覧ꢀPART NUMBERS  
HK0603  
自己共振周 波数  
流抵抗 定格電流  
厚 さ  
EHS  
(Environmental  
Hazardous  
Self-resonant  
インダクタンス  
Inductance  
hnHi  
LQ測  
定周 波数  
QfTypicalg  
Rated  
current  
hmAi  
max.  
Q
min.  
DC.Resistance  
hEi  
Thickness  
hmmi  
finchg  
形名  
Ordering code  
frequency  
[MHz]  
min. Typ. max. Typ.  
Measuring frequency  
周 波数 Frequency[MHz]  
[MHz]  
Substances)  
100 300 500 800 1000  
HK 0603 1N0G  
HK 0603 1N2G  
HK 0603 1N5G  
HK 0603 1N8G  
HK 0603 2N0G  
HK 0603 2N2G  
HK 0603 2N4G  
HK 0603 2N7G  
HK 0603 3N0G  
HK 0603 3N3G  
HK 0603 3N6G  
HK 0603 3N9G  
HK 0603 4N3G  
HK 0603 4N7G  
HK 0603 5N1G  
HK 0603 5N6G  
HK 0603 6N2Z  
HK 0603 6N8Z  
HK 0603 7N5Z  
HK 0603 8N2Z  
HK 0603 9N1Z  
HK 0603 10NZ  
HK 0603 12NZ  
HK 0603 15NZ  
HK 0603 18NZ  
HK 0603 22NZ  
HK 0603 27NZ  
HK 0603 33NZ  
HK 0603 39NZ  
HK 0603 47NZ  
HK 0603 56NZ  
HK 0603 68NZ  
HK 0603 82NZ  
HK 0603 R1 0Z  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
1.0M0.3nH ※  
1.2M0.3nH ※  
1.5M0.3nH ※  
1.8M0.3nH ※  
2.0M0.3nH ※  
2.2M0.3nH ※  
2.4M0.3nH ※  
2.7M0.3nH ※  
3.0M0.3nH ※  
3.3M0.3nH ※  
3.6M0.3nH ※  
3.9M0.3nH ※  
4.3M0.3nH ※  
4.7M0.3nH ※  
5.1M0.3nH ※  
5.6M0.3nH ※  
6.2M0.3nH ※  
6.8M5% ※  
7.5M5% ※  
8.2M5% ※  
9.1M5% ※  
10M5% ※  
12M5% ※  
15M5% ※  
18M5% ※  
22M5% ※  
4
4
4
4
4
4
4
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
4
4
4
4
4
4
4
4
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
6
6
6
6
6
6
6
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
6
6
6
6
6
6
6
6
12  
12  
12  
12  
12  
12  
12  
12  
12  
12  
12  
12  
12  
12  
12  
12  
11  
11  
11  
11  
11  
11  
11  
11  
11  
11  
10  
10  
10  
10  
10  
10  
10  
9
17  
16  
15  
15  
15  
15  
15  
15  
15  
15  
15  
15  
15  
15  
15  
15  
14  
14  
14  
14  
14  
14  
14  
13  
13  
13  
12  
12  
12  
11  
11  
11  
11  
10  
22  
21  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
19  
19  
19  
19  
18  
18  
18  
18  
17  
17  
17  
16  
16  
15  
14  
14  
13  
12  
11  
11  
10  
9
27 10000 X13000 0.14 0.088  
25 10000 X13000 0.14 0.089  
23 10000 X13000 0.18 0.11  
23 10000 X13000 0.19 0.12  
22 10000 X13000 0.20 0.13  
22 8800 12500 0.22 0.14  
22 8300 11700 0.24 0.15  
22 7700 11000 0.25 0.16  
22 7200 11000 0.28 0.18  
22 6700 9600 0.30 0.19  
22 6400 9100 0.30 0.20  
22 6000 8600 0.30 0.20  
21 5700 8100 0.40 0.22  
21 5300 7600 0.40 0.24  
21 5000 7100 0.40 0.26  
21 4600 6600 0.40 0.27  
20 4200 6100 0.44 0.29  
20 3900 5600 0.48 0.30  
19 3600 5300 0.53 0.34  
19 3400 4900 0.55 0.34  
18 3200 4600 0.62 0.40  
18 2900 4200 0.63 0.41  
18 2700 3800 0.7 0.45  
250  
250  
230  
200  
200  
200  
200  
200  
180  
180  
170  
170  
150  
150  
150  
150  
150  
150  
150  
150  
150  
150  
100  
100  
100  
100  
50  
0.30M0.03  
f0.012M0.001g  
17 2300 3300 0.8  
0.5  
17 2100 3000 0.9 0.57  
16 1800 2600 1.2 0.71  
15 1800 2600 1.8 1.11  
14 1700 2400 2.1 1.33  
12 1500 2100 2.4 1.51  
11 1300 1800 2.8 1.74  
10 1100 1600 3.0 1.85  
10 1100 1500 3.0 2.30  
27M5% ※  
33M5% ※  
39M5% ※  
47M5% ※  
56M5% ※  
68M5% ※  
82M5% ※  
100M5% ※  
50  
50  
50  
50  
50  
50  
40  
8
6
1000 1400 3.5 2.60  
900 1200 4.0 3.00  
形名のGZにはインダクタンス許容差記号が入ります±0.3nHfGg±5fZg以下の許容差も対応可能ですので問い合わせ下さい。  
G, Zmark indicates the Inductance tolerance code. The product with tolerance less than ±0.3nHfGg, ±5fZg is also available. Please contact your  
local sales office.  
HK1005  
自己共振周 波数  
定格電流  
流抵抗  
厚 さ  
EHS  
(Environmental  
Hazardous  
Substances)  
Self-resonant  
LQ測  
Rated current  
インダクタンス  
定周 波数  
QfTypicalg  
Q
DC.Resistance  
hEi  
Thickness  
形名  
frequency  
MeasuringhmAi
Inductance  
frequency  
波数 Frequency[MHz]  
min.  
Ordering code  
hmmi  
finchg  
max.  
[MHz]  
min. Typ. max. Typ.  
hnHi  
[MHz]  
K55 ~  
J125C  
K55 ~  
J85C  
100 300 500 800 1000  
1.0  
1.2  
1.5  
1.8  
2.0  
2.2  
2.4  
2.7  
3.0  
3.3  
3.6  
3.9  
4.3  
4.7  
5.1  
5.6  
6.2  
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
0.3nH  
0.3nH  
0.3nH  
0.3nH  
0.3nH  
0.3nH  
0.3nH  
0.3nH  
0.3nH  
0.3nH  
0.3nH  
0.3nH  
0.3nH  
0.3nH  
0.3nH  
0.3nH  
0.3nH  
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
11  
11  
11  
11  
11  
10  
10  
10  
10  
10  
10  
10  
10  
10  
10  
10  
10  
10  
10  
10  
10  
10  
11  
11  
11  
11  
11  
11  
11  
11  
11  
11  
10  
10  
10  
12  
12  
12  
12  
25  
25  
24  
23  
21  
18  
18  
18  
18  
18  
18  
18  
18  
18  
18  
18  
18  
18  
18  
18  
18  
18  
18  
18  
18  
17  
17  
16  
16  
16  
16  
15  
14  
14  
12  
17  
16  
16  
14  
34  
35  
33  
30  
27  
25  
24  
24  
24  
24  
24  
24  
24  
24  
24  
24  
24  
23  
23  
23  
23  
23  
23  
23  
23  
22  
21  
20  
20  
19  
18  
17  
16  
14  
10  
17  
K
43  
44  
44  
36  
34  
31  
31  
31  
31  
31  
31  
31  
31  
31  
31  
30  
30  
29  
29  
29  
29  
29  
29  
28  
28  
26  
25  
23  
23  
21  
18  
18  
15  
12  
K
52 10000 X13000 0.08 0.04 300 900  
52 10000 X13000 0.09 0.04 300 900  
48 6000 X13000 0.1 0.05 300 850  
42 6000 11000 0.12 0.06 300 700  
39 6000 10500 0.12 0.06 300 700  
36 6000 10000 0.13 0.07 300 700  
35 6000 9500 0.13 0.07 300 650  
34 6000 9000 0.13 0.08 300 650  
35 6000 8500 0.16 0.09 300 600  
35 6000 8000 0.16 0.1 300 550  
35 5000 7500 0.2 0.11 300 500  
35 4000 7000 0.21 0.12 300 500  
35 4000 6500 0.2 0.12 300 500  
34 4000 6000 0.21 0.12 300 500  
34 4000 5800 0.21 0.13 300 450  
35 4000 5700 0.23 0.15 300 430  
34 3900 5600 0.25 0.16 300 430  
32 3900 5500 0.25 0.17 300 430  
32 3700 5200 0.25 0.18 300 400  
31 3600 4900 0.28 0.21 300 380  
31 3400 4500 0.3 0.22 300 360  
31 3200 4300 0.31 0.23 300 340  
31 2700 3900 0.4 0.28 300 330  
30 2300 3500 0.46 0.31 300 320  
30 2100 3100 0.55 0.35 300 310  
27 1900 2800 0.6 0.42 300 300  
26 1600 2300 0.7 0.47 300 300  
HK 1005 1N0G  
HK 1005 1N2G  
HK 1005 1N5G  
HK 1005 1N8G  
HK 1005 2N0G  
HK 1005 2N2G  
HK 1005 2N4G  
HK 1005 2N7G  
HK 1005 3N0G  
HK 1005 3N3G  
HK 1005 3N6G  
HK 1005 3N9G  
HK 1005 4N3G  
HK 1005 4N7G  
HK 1005 5N1G  
HK 1005 5N6G  
HK 1005 6N2G  
HK 1005 6N8Z  
HK 1005 7N5Z  
HK 1005 8N2Z  
HK 1005 9N1Z  
HK 1005 10NZ  
HK 1005 12NZ  
HK 1005 15NZ  
HK 1005 18NZ  
HK 1005 22NZ  
HK 1005 27NZ  
HK 1005 33NZ  
HK 1005 39NZ  
HK 1005 47NZ  
HK 1005 56NZ  
HK 1005 68NZ  
HK 1005 82NZ  
HK 1005 R10Z  
HK 1005 R12Z  
HK 1005 R15Z  
HK 1005 R18Z  
HK 1005 R22Z  
HK 1005 R27Z  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
6.8  
M
5%  
5%  
5%  
5%  
0.50M0.05  
7.5  
8.2  
9.1  
M
M
M
f0.020M0.002g  
10  
12  
15  
18  
22  
27  
33  
39  
47  
56  
68  
82  
100  
120  
150  
180  
220  
270  
M
5%  
5%  
5%  
5%  
5%  
5%  
5%  
5%  
5%  
5%  
5%  
5%  
M
M
M
M
M
M
M
M
M
M
M
22 1300 1900 0.8  
0.5 200 250  
21 1200 1700 0.9 0.52 200 250  
18 1000 1500  
16 750 1300  
11 750 1200 1.2  
1
1
0.58 200 230  
0.61 200 220  
0.7 180 200  
6
600 1100 1.3 0.81 150 200  
600 1000 1.5 0.94 150 200  
M
5%  
5%  
5%  
5%  
5%  
5%  
K
K
K
K
K
K
M
M
M
M
M
600 800  
550 920  
500 810  
450 700  
400 600  
1.6  
1.1 150 200  
K
3.2 2.57 140 200  
3.7 2.97 130 200  
4.2 3.29 120 200  
4.8 3.92 110 200  
K
K
K
K
K
形名のGZにはインダクタンス許容差記号が入ります±0.3nHfGg±5fZg以下の許容差も対応可能ですので問い合わせ下さい。  
G, Zmark indicates the Inductance tolerance code. The product with tolerance less than ±0.3nHfGg, ±5fZg is also available. Please contact your  
local sales office.  
222  
アイテム一覧ꢀPART NUMBERS  
HK1608  
EHS  
(Environmental  
Hazardous  
Substances)  
自己共振周 波数  
流抵抗 定格電流  
厚 さ  
Self-resonant  
インダクタンス  
Inductance  
LQ測  
定周 波数  
QfTypicalg  
Rated  
current  
hmAi  
max.  
Q
min.  
DC.Resistance  
hEi  
Thickness  
hmmi  
形名  
Ordering code  
frequency  
[MHz]  
min. Typ.  
Measuring frequency  
周 波数 Frequency[MHz]  
hnHi  
[MHz]  
100 300 500 800 1000  
max. Typ.  
finchg  
HK 1608 1N 0G  
HK 1608 1N 2G  
HK 1608 1N 5G  
HK 1608 1N 8G  
HK 1608 2N 2G  
HK 1608 2N 7G  
HK 1608 3N 3G  
HK 1608 3N 9G  
HK 1608 4N 7G  
HK 1608 5N 6G  
HK 1608 6N 8Z  
HK 1608 8N 2Z  
HK 1608 10 NZ  
HK 1608 12 NZ  
HK 1608 15 NZ  
HK 1608 18 NZ  
HK 1608 22 NZ  
HK 1608 27 NZ  
HK 1608 33 NZ  
HK 1608 39 NZ  
HK 1608 47 NZ  
HK 1608 56 NZ  
HK 1608 68 NZ  
HK 1608 82 NZ  
HK 1608 R1 0Z  
HK 1608 R1 2Z  
HK 1608 R1 5Z  
HK 1608 R1 8Z  
HK 1608 R2 2Z  
HK 1608 R2 7Z  
HK 1608 R3 3Z  
HK 1608 R3 9Z  
HK 1608 R4 7Z  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
1.0M0.3nH ※  
1.2M0.3nH ※  
1.5M0.3nH ※  
1.8M0.3nH ※  
2.2M0.3nH ※  
2.7M0.3nH ※  
3.3M0.3nH ※  
3.9M0.3nH ※  
4.7M0.3nH ※  
5.6M0.3nH ※  
6.8M5L ※  
8.2M5L ※  
10M5L ※  
12M5L ※  
15M5L ※  
18M5L ※  
22M5L ※  
27M5L ※  
33M5L ※  
39M5L ※  
47M5L ※  
8
8
8
8
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
50  
14  
14  
14  
10  
12  
13  
14  
13  
13  
14  
14  
14  
14  
14  
15  
15  
16  
16  
17  
18  
17  
17  
18  
18  
18  
16  
13  
13  
12  
14  
14  
13  
13  
30  
30  
26  
18  
22  
24  
25  
25  
25  
25  
25  
26  
26  
27  
28  
27  
28  
29  
31  
31  
28  
28  
29  
28  
27  
24  
19  
18  
16  
15  
40  
40  
34  
24  
29  
32  
33  
33  
33  
33  
33  
34  
34  
35  
37  
36  
36  
37  
40  
39  
34  
34  
34  
33  
28  
23  
16  
12  
70  
70  
47  
30  
37  
41  
42  
42  
42  
42  
43  
44  
43  
45  
46  
44  
44  
45  
46  
44  
35  
34  
30  
27  
16  
90 10000 X13000 0.05 0.015  
90 10000 X13000 0.05 0.015  
50 6000 X13000 0.10 0.03  
34 6000 X13000 0.10 0.06  
40 6000 12000 0.10 0.06  
45 6000 11000 0.10 0.06  
47 6000 9000 0.12 0.06  
46 6000 8000 0.14 0.07  
47 4000 6500 0.16 0.08  
46 4000 5800 0.18 0.09  
47 4000 5600 0.22 0.11  
48 3500 5200 0.24 0.13  
47 3400 4600 0.26 0.16  
49 2600 4000 0.28 0.17  
51 2300 3400 0.32 0.20  
48 2000 3000 0.35 0.21  
47 1600 2900 0.40 0.25  
46 1400 2200 0.45 0.28  
47 1200 1800 0.55 0.35  
44 1100 1600 0.60 0.38  
34 900 1600 0.70 0.45  
31 900 1400 0.75 0.50  
22 700 1200 0.85 0.55  
600 1100 0.95 0.60  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
150  
150  
150  
150  
8
10  
10  
10  
10  
10  
10  
10  
12  
12  
12  
12  
12  
12  
12  
12  
12  
12  
12  
12  
12  
8
5
0.8M0.15  
f0.031M0.006g  
56M5L ※  
68M5L ※  
82M5L ※  
100M5L ※  
120M5L ※  
150M5L ※  
180M5L ※  
220M5L ※  
270M5L ※  
330M5L ※  
390M5L ※  
470M5L ※  
600 1000 1.00 0.65  
500 800 1.20 0.68  
500 800 1.20 0.73  
400 700 1.30 0.85  
8
8
8
8
8
8
8
50  
50  
50  
50  
50  
50  
50  
400 600 1.50 0.95  
400 550  
350 480  
350 410  
300 360  
1.9 1.34  
2.1 1.53  
2.3 1.72  
2.6 2.04  
形名のGZにはインダクタンス許容差記号が入ります±0.3nHfGg±5fZg以下の許容差も対応可能ですので問い合わせ下さい。  
G, Zmark indicates the Inductance tolerance code. The product with tolerance less than ±0.3nHfGg, ±5fZg is also available. Please contact your  
local sales office.  
HK2125  
自己共振周 波数  
Q
流抵抗 定格電流  
厚 さ  
EHS  
(Environmental  
Hazardous  
Self-resonant  
LQ定周 波数  
Typical  
インダクタンス  
Inductance  
Q
min.  
DC-Resistance Rated  
Thickness  
hmmi  
形名  
Ordering code  
Frequency  
[MHz]  
Measuring frequency  
波数 Frequency[MHz]  
hEi  
current  
hmAi  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
hnHi  
[MHz]  
Substances)  
100 300 500 800 1000 min.Typ. max. Typ.  
finchg  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
1.5M0.3nH  
1.8M0.3nH  
2.2M0.3nH  
2.7M0.3nH  
3.3M0.3nH  
3.9M0.3nH  
4.7M0.3nH  
5.6M0.3nH  
6.8M5L  
8.2M5L  
10M5L  
10  
10  
10  
12  
12  
12  
12  
15  
15  
15  
15  
15  
15  
15  
18  
18  
18  
18  
18  
18  
18  
18  
18  
13  
13  
13  
12  
12  
12  
10  
10  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
50  
21  
18  
18  
19  
16  
18  
18  
20  
20  
21  
20  
21  
22  
24  
23  
23  
24  
23  
23  
23  
25  
24  
23  
22  
22  
23  
20  
20  
22  
17  
17  
39  
35  
33  
36  
29  
33  
34  
38  
39  
40  
38  
39  
42  
44  
43  
42  
43  
41  
41  
42  
42  
41  
37  
33  
34  
34  
23  
19  
15  
12  
57  
49  
46  
50  
40  
46  
46  
51  
52  
54  
51  
52  
55  
57  
55  
53  
54  
50  
49  
48  
45  
41  
37  
29  
26  
20  
61  
55  
53  
56  
47  
54  
55  
60  
63  
63  
60  
60  
63  
63  
60  
58  
55  
47  
43  
39  
30  
68 4000 X6000 0.10 0.02  
59 4000 X6000 0.10 0.02  
58 4000 X6000 0.10 0.03  
60 4000 X6000 0.10 0.03  
51 4000 X6000 0.13 0.04  
60 4000 X6000 0.15 0.05  
60 3500 X6000 0.20 0.05  
66 3200 5400 0.23 0.05  
69 2800 4200 0.25 0.06  
70 2400 3700 0.28 0.07  
67 2100 3100 0.30 0.09  
67 1900 3000 0.35 0.10  
72 1600 2600 0.40 0.11  
72 1500 2300 0.45 0.13  
69 1400 2100 0.50 0.16  
68 1300 1800 0.55 0.17  
60 1200 1700 0.60 0.19  
47 1000 1400 0.65 0.25  
41 900 1200 0.70 0.26  
38 800 1100 0.75 0.28  
700 900 0.80 0.33  
HK 2125 1N5S  
HK 2125 1N8S  
HK 2125 2N2S  
HK 2125 2N7S  
HK 2125 3N3S  
HK 2125 3N9S  
HK 2125 4N7S  
HK 2125 5N6S  
HK 2125 6N8J  
HK 2125 8N2J  
HK 2125 10NJ  
HK 2125 12NJ  
HK 2125 15NJ  
HK 2125 18NJ  
HK 2125 22NJ  
HK 2125 27NJ  
HK 2125 33NJ  
HK 2125 39NJ  
HK 2125 47NJ  
HK 2125 56NJ  
HK 2125 68NJ  
HK 2125 82NJ  
HK 2125 R10J  
HK 2125 R12J  
HK 2125 R15J  
HK 2125 R18J  
HK 2125 R22J  
HK 2125 R27J  
HK 2125 R33J  
HK 2125 R39J  
HK 2125 R47J  
0.85M0.2  
f0.033M0.008g  
12M5L  
15M5L  
18M5L  
22M5L  
27M5L  
33M5L  
39M5L  
47M5L  
56M5L  
68M5L  
82M5L  
600 800 0.90 0.37  
100M5L  
120M5L  
150M5L  
180M5L  
220M5L  
270M5L  
330M5L  
390M5L  
470M5L  
600 800 0.90 0.40  
J0.2  
1.00  
500 700 0.95 0.43  
K0.3  
50  
500 700 1.00 0.46  
J0.008  
0.039  
fꢀꢀ ꢀꢀg  
50  
400 600 1.10 0.50  
K0.012  
50  
350 550 1.20 0.75  
50  
300 480 1.30 0.85  
50  
250 400 1.40 0.90  
50  
250 400 1.30 0.85  
50  
200 350 1.50 0.95  
223  
特性図ꢀELECTRICAL CHARACTERISTICS  
Q-周 波数特性例ꢀQ-CharacteristicsfMeasured by HP8719Cg  
HK0603  
6.8nH  
22nH  
10nH  
47nH  
0.01  
0.1  
1
10  
インピーダンス周 波数特性例ꢀImpedance-vs-Frequency characteristicsfMeasured by HP8719Cg  
HK0603  
6
10  
22nH  
4
10  
10nH  
6.8nH  
47nH  
2
10  
0
10  
0.01  
0.1  
1
10  
インダクタンス周 波数特性例ꢀInductance-vs-Frequency characteristicsfMeasured by HP8719Cg  
HK0603  
47nH  
22nH  
10nH  
6.8nH  
0.01  
0.1  
1
10  
224  
外形寸法ꢀEXTERNAL DIMENSIONS  
HKQ Type  
Type  
HKQ0603  
f0201g  
L
W
T
e
0.6M0.03  
0.3M0.03  
0.3M0.03  
0.15M0.05  
f0.024M0.001g f0.012M0.001g  
f0.012M0.001g f0.006M0.002g  
UnitDmmfinchg  
概略バリエーションꢀAVAILABLE INDUCTANCE RANGE  
Type  
HKQ0603  
Range  
使用温度範囲 -55~+125℃�  
Imax�  
[nH]�  
1.0�  
1.2�  
1.5�  
1.8�  
2.2�  
2.7�  
3.3�  
3.9�  
4.7�  
5.6�  
6.8�  
8.2�  
10.0  
[mA]�  
400  
1N0□�  
1N2□�  
1N5□�  
1N8□�  
2N2□�  
2N7□�  
3N3□�  
3N9□�  
4N7□�  
5N6□�  
6N8○�  
8N2○�  
10N○�  
350  
300�  
300�  
250�  
200�  
200�  
170�  
170�  
150�  
150  
Inductance  
Imax[mA]  
Rdcmax[E]  
1.5nH  
10.0nH  
100.0nH  
350  
150  
K
0.13  
0.83  
K
形名のGZにはインダクタンス許容差記号が入ります±0.3nHfGg±5fZg以下の許容差も対応可能ですので問い合わせ下さい。  
G, Zmark indicates the Inductance tolerance code. The product with tolerance less than ±0.3nHfGg, ±5fZg is also available. Please contact your  
local sales office.  
アイテム一覧ꢀPART NUMBERS  
HKQ0603  
自己共振周 波数  
流抵抗 定格電流  
厚 さ  
EHS  
(Environmental  
Hazardous  
インダクタンス  
Inductance  
hnHi  
LQ測  
定周 波数  
QfTypicalg  
Self-resonant  
Rated  
current  
hmAi  
max.  
Q
min.  
DC.Resistance  
hEi  
Thickness  
hmmi  
形名  
Ordering code  
frequency  
[MHz]  
min. Typ. max. Typ.  
Measuring frequency  
波数 Frequency[MHz]  
[MHz]  
Substances)  
100 300 500 800 1000  
finchg  
HKQ 0603 1N0G  
HKQ 0603 1N2G  
HKQ 0603 1N5G  
HKQ 0603 1N8G  
HKQ 0603 2N2G  
HKQ 0603 2N7G  
HKQ 0603 3N3G  
HKQ 0603 3N9G  
HKQ 0603 4N7G  
HKQ 0603 5N6G  
HKQ 0603 6N8Z  
HKQ 0603 8N2Z  
HKQ 0603 10NZ  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
RoHS  
1.0M0.3nH ※  
1.2M0.3nH ※  
1.5M0.3nH ※  
1.8M0.3nH ※  
2.2M0.3nH ※  
2.7M0.3nH ※  
3.3M0.3nH ※  
3.9M0.3nH ※  
4.7M0.3nH ※  
5.6M0.3nH ※  
6.8M5% ※  
4
4
4
4
4
5
5
5
5
5
5
5
5
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
7
7
7
7
7
7
7
7
7
7
7
7
7
14  
13  
13  
13  
12  
12  
12  
12  
12  
12  
12  
12  
12  
19  
18  
17  
17  
17  
16  
16  
16  
16  
16  
16  
16  
16  
26  
25  
23  
23  
22  
22  
22  
22  
21  
21  
21  
21  
21  
31 10000 X13000 0.10 0.04  
29 10000 X13000 0.13 0.08  
26 10000 X13000 0.13 0.07  
26 9500 X13000 0.13 0.08  
25 9000 13000 0.19 0.12  
24 7700 11000 0.19 0.11  
24 7000 10000 0.27 0.17  
24 7000 10000 0.44 0.27  
24 5500 8000 0.44 0.22  
24 5500 8000 0.55 0.35  
24 5000 7500 0.61 0.38  
23 4500 6500 0.72 0.45  
23 4000 6000 0.83 0.52  
400  
350  
350  
350  
300  
300  
250  
200  
200  
170  
170  
150  
150  
0.30M0.03  
f0.012M0.001g  
8.2M5% ※  
10M5% ※  
形名のGZにはインダクタンス許容差記号が入ります±0.3nHfGg±5fZg以下の許容差も対応可能ですので問い合わせ下さい。  
G, Zmark indicates the Inductance tolerance code. The product with tolerance less than ±0.3nHfGg, ±5fZg is also available. Please contact your  
local sales office.  
226  
特性図ꢀELECTRICAL CHARACTERISTICS  
Q-周 波数特性例ꢀQ-CharacteristicsfMeasured by HP8719Cg  
HKQ0603  
50  
45  
2.2nH  
40  
35  
30  
10nH  
25  
20  
15  
10  
5
0
0.01  
0.1  
1
10  
5
インピーダンス周 波数特性例ꢀImpedance-vs-Frequency characteristicsfMeasured by HP8719Cg  
HKQ0603  
4
10  
10nH  
2
10  
2.2nH  
0
10  
0.01  
0.1  
1
10  
インダクタンス周 波数特性例ꢀInductance-vs-Frequency characteristicsfMeasured by HP8719Cg  
HKQ0603  
10nH  
2.2nH  
0.01  
0.1  
1
10  
227  
梱包ꢀPACKAGING  
1最小受注単位数 Minimum Quantity  
Fテーピング梱包ꢀTape & Reel Packaging  
2テーピング材質ꢀTaping material  
製品厚  
標準数量[pcs]  
形ꢀꢀ式  
Type  
Thickness  
[mm]  
finchg  
0.8  
Standard Quantity  
紙テープ  
エンボステープ  
Paper Tape Embossed Tape  
CK1608f0603g  
CK2125f0805g  
4000  
4000  
E
E
E
f0.031g  
0.85  
f0.033g  
1.25  
2000  
4000  
E
f0.049g  
0.8  
CKP3216f1206g  
LK1005f0402g  
LK1608f0603g  
E
f0.031g  
0.5  
10000  
4000  
4000  
E
f0.020g  
0.8  
E
f0.031g  
0.85  
E
f0.033g  
1.25  
LK2125f0805g  
2000  
E
C K  
1 6 0 8  
2 1 2 5  
1 0 0 5  
1 6 0 8  
2 1 2 5  
0 6 0 3  
0 6 0 3  
1 0 0 5  
1 6 0 8  
0 6 0 3  
1 0 0 5  
1 6 0 8  
2 1 2 5  
2 0 1 0  
1 0 0 5  
1 6 0 8  
2 1 2 5  
f0.049g  
0.3  
C K  
L K  
L K  
HKQ0603f0201g  
HK0603f0201g  
HK1005f0402g  
HK1608f0603g  
15000  
15000  
10000  
4000  
E
L K  
f0.012g  
0.3  
H K Q  
H K  
E
H K  
f0.012g  
0.5  
H K  
B K  
E
B K  
f0.020g  
0.8  
B K  
B K  
E
B K  
f0.031g  
0.85  
B K P  
B K P  
B K P  
4000  
3000  
E
f0.033g  
1.0  
HK2125f0805g  
E
f0.039g  
0.3  
BK0603f0201g  
BK1005f0402g  
BK1608f0603g  
15000  
10000  
4000  
4000  
E
f0.012g  
0.5  
E
f0.020g  
0.8  
E
f0.031g  
0.85  
E
f0.033g  
1.25  
BK2125f0805g  
2000  
E
f0.049g  
0.45  
BK2010f0804g  
BK3216f1206g  
BKP1005f0402g  
BKP1608f0603g  
BKP2125f0805g  
4000  
E
f0.018g  
0.8  
4000  
E
f0.031g  
0.5  
10000  
4000  
4000  
f0.020g  
0.8  
E
C K  
C K P  
L K  
2 1 2 5  
3 2 1 6  
2 1 2 5  
2 1 2 5  
2 1 2 5  
3 2 1 6  
f0.031g  
0.85  
E
f0.033g  
H K  
B K  
B K  
258  
梱包ꢀPACKAGING  
3テーピング寸法ꢀTaping Dimensions  
チップ挿入部  
挿入ピッチ テープ厚 みmax.  
製品厚  
形ꢀꢀ式  
Chip cavity  
Insertion Pitch  
F
Tape Thickness  
Thickness  
Paper tape (0.315 inches wide)  
Y紙テープ(8mm幅)  
Type  
hmmi  
A
B
K
T
1.25  
f0.049g  
0.8  
1.5M0.2  
2.3M0.2  
4.0M0.1  
2.0  
0.3  
CK2125f0805g  
CKP3216f1206g  
LK2125f0805g  
f0.059M0.008g  
1.9M0.1  
f0.091M0.008g  
3.5M0.1  
f0.157M0.004g  
4.0M0.1  
f0.079g f0.012g  
1.4 0.3  
f0.055g f0.012g  
2.0 0.3  
f0.031g  
1.25  
f0.075M0.004g  
1.5M0.2  
f0.138M0.004g  
2.3M0.2  
f0.157M0.004g  
4.0M0.1  
f0.049g  
0.85  
f0.059M0.008g  
f0.091M0.008g  
f0.157M0.004g  
f0.079g f0.012g  
5
1.5  
f0.033g  
1.0  
1.5M0.2  
2.3M0.2  
4.0M0.1  
f0.059g  
2.0  
0.3  
HK2125f0805g  
f0.059M0.008g  
f0.091M0.008g  
f0.157M0.004g  
f0.012g  
f0.039g  
1.25  
f0.079g  
2.0  
Unit : mm (inch)  
1.5M0.2  
f0.059M0.008g  
1.9M0.1  
2.3M0.2  
f0.091M0.008g  
3.5M0.1  
4.0M0.1  
0.3  
BK2125f0805g  
BK3216f1206g  
製品厚  
チップ挿入部  
挿入ピッチ テープ厚  
f0.049g  
0.8  
f0.157M0.004g f0.079g f0.012g  
形ꢀꢀ式  
Thickness  
hmmi  
0.8  
Chip cavity  
Insertion Pitch Tape Thickness  
4.0M0.1  
1.4  
0.3  
Type  
A
B
F
T
f0.031g  
f0.075M0.004g  
f0.138M0.004g  
f0.157M0.004g  
f0.055g f0.012g  
1.0M0.2  
1.8M0.2  
4.0M0.1  
1.1max  
CK1608f0603g  
CK2125f0805g  
LK1005f0402g  
LK1608f0603g  
LK2125f0805g  
HKQ0603(0201)  
HK0603(0201)  
HK1005f0402g  
HK1608f0603g  
BK0603f0201g  
BK1005f0402g  
BK1608f0603g  
BK2125f0805g  
BK2010f0804g  
f0.031g  
0.85  
f0.033g  
0.5  
f0.039M0.008g f0.071M0.008g f0.157M0.004g f0.043maxg  
4リーダー部・空部 LEADER AND BLANK PORTION  
1.5M0.2  
2.3M0.2  
4.0M0.1  
1.1max  
f0.059M0.008g f0.091M0.008g f0.157M0.004g f0.043maxg  
0.65M0.1 1.15M0.1 2.0M0.05 0.8max  
f0.026M0.004g f0.045M0.004g f0.079M0.002g f0.031maxg  
f0.020g  
0.8  
1.0M0.2  
1.8M0.2  
4.0M0.1  
1.1max  
f0.031g  
0.85  
f0.033g  
0.3  
f0.039M0.008g f0.071M0.008g f0.157M0.004g f0.043maxg  
1.5M0.2  
2.3M0.2  
4.0M0.1  
1.1max  
f0.059M0.008g f0.091M0.008g f0.157M0.004g f0.043maxg  
0.40M0.06 0.70M0.06 2.0M0.05 0.45max  
f0.016M0.002g f0.028M0.002g f0.079M0.002g f0.018maxg  
0.40M0.06 0.70M0.06 2.0M0.05 0.45max  
f0.016M0.002g f0.028M0.002g f0.079M0.002g f0.018maxg  
0.65M0.1 1.15M0.1 2.0M0.05 0.8max  
f0.026M0.004g f0.045M0.004g f0.079M0.002g f0.031maxg  
160mm以上  
6.3inches or more  
100mm以上  
f3.94inches or moreg  
f
g
f0.012g  
0.3  
引き出し方向  
Direction of tape feed  
400mm以上  
f15.7inches or moreg  
f0.012g  
0.5  
5リール寸法 Reel Size  
f0.020g  
0.8  
1.0M0.2  
1.8M0.2  
4.0M0.1  
1.1max  
f0.031g  
0.3  
f0.039M0.008g f0.071M0.008g f0.157M0.004g  
f0.043maxg  
2.0M0.5  
f0.079M0.031g  
0.40M0.06 0.70M0.06 2.0M0.05 0.45max  
f0.016M0.002g f0.028M0.002g f0.079M0.002g f0.018maxg  
0.65M0.1 1.15M0.1 2.0M0.05 0.8max  
B13.0M0.2  
fB0.512M0.020g  
f0.012g  
0.5  
f0.020g  
0.8  
f0.026M0.004g f0.045M0.004g f0.079M0.002g  
f0.031maxg  
1.0M0.2  
1.8M0.2  
4.0M0.1  
1.1max  
f0.031g  
0.85  
f0.033g  
0.45  
f0.018g  
0.5  
f0.039M0.008g f0.071M0.008g f0.157M0.004g f0.043maxg  
4.0M0.1  
1.1max  
1.5M0.2  
2.3M0.2  
f0.059M0.008g f0.091M0.008g f0.157M0.004g f0.043maxg  
1.2M0.1  
2.17M0.1 4.0M0.1 0.80max  
f0.047M0.004g  
f0.085M0.004g f0.157M0.004g f0.031maxg  
0.65M0.1 1.15M0.1 2.0M0.05 0.8max  
BKP1005f0402g  
BKP1608f0603g  
BKP2125f0805g  
f0.020g  
0.8  
f0.026M0.004g f0.045M0.004g f0.079M0.002g  
f0.031maxg  
1.0M0.2  
f0.039M0.008g  
1.5M0.2  
1.8M0.2  
4.0M0.1  
1.1max  
f0.031g  
0.85  
f0.033g  
f0.071M0.008g f0.157M0.004g f0.043maxg  
2.3M0.2  
4.0M0.1  
1.1max  
f0.059M0.008g  
f0.091M0.008g f0.157M0.004g f0.043maxg  
6トップテープ強度ꢀTop tape strength  
トップテープの剥離力は、下図矢印方向にて0.10.7Nとなります。  
The top tape requires a peel-off force of 0.1V0.7N in the direction of  
the arrow as illustrated below.  
Embossed Tape (0.312 inches wide)  
Yエンボステープ(8mm幅)  
Unit : mm (inch)  
259  
1/4  
RELIABILITY DATA  
Multilayer chip inductors and beads  
Specified Value  
ARRAY  
Test Methods and Remarks  
Item  
BK0603 BK1005 BK1608 BK2125  
BKP1005 BKP1608 BKP2125 CK1608 CK2125 CKP3216 LK1005 LK1608 LK2125 HKQ0603 HK0603 HK1005 HK1608 HK2125  
BK2010 BK3216  
1.Operating  
K55VJ85C  
K55VJ85C  
K55VJ125C  
K55VJ125C  
K40VJ85C  
K40VJ85C  
K55VJ125C  
K55VJ125C  
K40VJ85C  
K40VJ85C  
Temperature  
Range  
2.Storage Tem-  
perature Range  
3.Rated Current  
5
100V  
150V  
150V  
200V  
100mA 100V  
1.0A  
1.0V  
3.0A  
DC  
2.0V  
4.0A  
DC  
40V  
100mA 500mA 1.1A  
DC DC DC  
60V  
0.7V  
10V  
25mA  
DC  
1V  
5V  
300mA 400mA 250mA 300mA 300mA DC  
DC DC DC DC DC  
150V  
40V  
110V  
150V  
300mA  
500mA 1000mA 1500mA 1200mA DC  
200mA DC  
50mA  
DC  
DC  
DC  
DC  
DC  
DC  
BK0603 Series:  
4.Impedance  
10V  
600E  
10V  
22V  
15V  
5V  
68V  
120E  
33V  
390E  
M25L  
33V  
220E  
M25L  
Measuring frequency: 100M1MHz  
Measuring equipment: HP4291A  
Measuring jig: 16193A  
1000E 2500E 2500E 600E  
1000E M25L  
M25L M25L  
M25L M25L M25L M25L  
BK1005 Series:  
BKP1005 Series:  
Measuring frequency: 100M1MHz  
Measuring equipment: HP4291A  
Measuring jig: 16192A, 16193A  
BB  
BB  
BB  
BB  
BB  
BB  
BB  
BB  
BB  
BB  
BB  
BK1608, 2125 Series:  
BKP1608, 2125 Series:  
Measuring frequency: 100M1MHz  
Measuring equipment: HP4291A, HP4195A  
Measuring jig: 16092A or 16192A (HW)  
BK2010, 3216 Series:  
Measuring frequency: 100M1MHz  
Measuring equipment: HP4291A, HP4195A  
Measuring jig: 16192A  
5.Inductance  
2.2V  
0.1V  
1.0V  
0.12V 0.047V 0.047V 1.0V5.6nH 1.0V6.2nH 1.0V6.2nH 1.0V5.6nH 1.0V5.6nH  
CK Series:  
10.0AH 10.0AH 4.7AH 2.2AH 33.0AH 33.0AH DM0.3nH DM0.3nH DM0.3nH DM0.3nH DM0.3nH  
DM20L DM20L DM20L DM10L DM20L DM20L 6.8V10nH 6.8V100nH 6.8V270nH 6.8V470nH 6.8V470nH  
Measuring frequency: 2 to 4MHz (CK1608)  
Measuring frequency: 2 to 25MHz (CK2125)  
Measuring frequency: 1MHz (CKP3216)  
DM5L  
DM5L  
DM5L  
DM5L  
DM5L  
at DC  
200mA  
0.4V  
0.10V 0.10V  
12.0AH 12.0AH  
DM10L DM10L  
LK Series:  
Measuring frequency: 10 to 25MHz (LK1005)  
Measuring frequency: 1 to 50MHz (LK1608)  
Measuring frequency: 0.4 to 50MHz (LK2125)  
Measuring equipment, jig:  
1.8AH  
min.  
HP4194J16085BJ16092A (or its equivalent)  
HP4195J41951J16092A (or its equivalent)  
HP4294J16192A  
HP4291AJ16193A (LK1005)  
HP4285AJ42841AJ42842CJ  
42851-61100 (CKP3216)  
BB  
Measuring current:  
1mA rms (0.047 to 4.7AH)  
0.1mA rms (5.6 to 33AH)  
HK Series:  
Measuring frequency:  
100MHz (HKQ0603,HK0603, HK1005)  
Measuring frequency:  
50/100MHz (HK1608, HK2125)  
Measuring equipment, jig:  
HP4291AJ16197A (HKQ0603,HK0603)  
HP4291AJ16193A (HK1005)  
HP4291A (or its equivalent)J16092AJ  
in-house made jig (HK1608, 2125)  
* Definition of rated current : In the CK and BK Series, the rated current is the value of current at which the temperature of the element is increased within 20C.  
In the BK Series P type and CK Series P type, the rated current is the value of current at which the temperature of the element is increased within 40C.  
In the LK and HK Series, the rated current is either the DC value at which the internal L value is decreased within 5% with the application of DC bias, or the value of  
current at which the temperature of the element is increased within 20C.  
261  
2/4  
RELIABILITY DATA  
Multilayer chip inductors and beads  
Specified  
Value  
ARRAY  
Test Methods and Remarks  
Item  
BK0603 BK1005 BK1608 BK2125  
BKP1005 BKP1608 BKP2125 CK1608 CK2125 CKP3216 LK1005 LK1608 LK2125 HKQ0603 HK0603 HK1005 HK1608 HK2125  
BK2010 BK3216  
6.Q  
20  
15V20  
10V20 10V35 15V50 4V5  
min. min. min. min.  
4V5  
8min. 8V12 10V18 CKSeries:  
min.  
min.  
min.  
min.  
min.  
Measuring frequency: 2 to 4 MHz (CK1608)  
Measuring frequency: 2 to 25 MHz (CK2125)  
LK Series:  
5
Measuring frequency: 10 to 25 MHz (LK1005)  
Measuring frequency: 1 to 50 MHz (LK1608)  
Measuring frequency: 0.4 to 50MHz (LK2125)  
Measuring equipment, jig:  
HP4194A +16085B +16092A (or its equivalent)  
HP4195A + 41951 + 16092A (or its equivalent)  
HP4294A + 16192A  
HP4291A + 16193A (LK1005)  
Measuring current:  
BB  
BB  
1mA rms (0.047 to 4.7AH)  
0.1mA rms (5.6 to 33AH)  
HK Series:  
Measuring frequency:  
100MHz (HKQ0603,HK0603, HK1005)  
Measuring frequency:  
50 / 100MHz (HK1608, 2125)  
Measuring equipment, jig:  
(
HP4291A + 16197A HKQ0603,HK0603)  
HP4291A + 16193A HK1005)  
(
HP4195A + 16092A + in-house made jig  
(HK1608, 2125)  
7.DC Resistance  
0.075V 0.05V 0.05V 0.05V 0.10V 0.15V 0.140E 0.025V 0.020V 0.30V 0.16V 0.11V 0.7V 0.3V 0.20V 0.10V 0.14V 0.08V 0.05V 0.10V  
1.50E 0.80E 1.10E 0.75E 0.90E 0.80E max. 0.140E 0.050E 0.90E 0.65E 0.20E 1.70E 2.95E 1.25E 0.83E 4.0E 4.8E 2.6E 1.5E  
max. max. max. max. max. max.  
max. max.  
(M  
30  
L
) max. max. max. max. max. max. max. max. max. max.  
Measuring equipment:  
VOACK7412 (made by Iwasaki Tsushinki)  
VOACK7512 (made by Iwasaki Tsushinki)  
17V  
33MHz 235MHz  
min. min.  
24V  
40V  
9V  
13V  
4000V 900V  
400V  
300V  
200V  
LK Series:  
8.Self Resonance  
Frequency(SRF)  
180MHz 260MHz 320MHz 10000MHz 10000MHz 10000MHz 10000MHz 4000MHz Measuring equipment: HP4195A  
min.  
min.  
min.  
min.  
min.  
min.  
min.  
min.  
Measuring jig: 41951 + 16092A  
(or its equivalent)  
BB  
BB  
HK Series:  
Measuring equipment: HP8719C  
YHP8753DfHK2125g  
9.Temperature  
Characteristic  
HK Series:  
Inductance change:  
Temperature range: -30 to +85C  
Reference temperature: +20C  
WithinM10%  
BB  
BB  
No mechanical damage.  
10. Resistance to  
Flexure of  
Warp: 2mm  
Testing board: glass epoxy-resin substrate  
Thickness: 0.8mm  
Substrate  
263  
3/4  
RELIABILITY DATA  
Multilayer chip inductors and beads  
Specified Value  
ARRAY  
Test Methods and Remarks  
Item  
BK0603 BK1005 BK1608 BK2125  
BKP1005 BKP1608 BKP2125 CK1608 CK2125 CKP3216 LK1005 LK1608 LK2125 HKQ0603 HK0603 HK1005 HK1608 HK2125  
BK2010 BK3216  
11.Solderability  
At least 75% of terminal electrode is covered by new solder.  
At least 75% of terminal electrode is covered by new solder.  
Solder temperature: 230M5C  
Duration: 4M1 sec.  
12.Resistance to  
Soldering  
Appearance: No significant abnormality  
Solder temperature: 260M5C  
No mechanical  
damage.  
No mechanical  
damage.  
No mechanical  
damage.  
Impedance change: WithinM30%  
Duration: 10M0.5 sec.  
5
Preheating temperature: 150 to 180C  
Preheating time: 3 min.  
Remaining terminal Remaining terminal Remaining terminal  
electrode: 70% min. electrode: 70% min. electrode: 70% min.  
Inductance change  
R10V4R7:  
Inductance change Inductance change:  
Flux: Immersion into methanol solution with  
colophony for 3 to 5 sec.  
47NV4R7:  
WithinM10%  
5R6V330:  
WithinM5%  
WithinM10%  
6R8V100:  
Recovery: 2 to 3 hrs of recovery under the stan-  
dard condition after the test. (See Note 1)  
WithinM15%  
CKP3216:  
WithinM15%  
WithinM30%  
13.Thermal Shock  
Appearance: No significant abnormality  
No mechanical  
damage.  
No mechanical damage.  
No  
mechanical  
damage.  
No  
mechanical  
damage.  
Conditions for 1 cycle  
Impedance change: Within M30%  
Inductance change: WithinM10%  
step 1: Minimum operating temperature  
Inductance change: Qchange: WithinM20%  
J0/K3C 30M3 min.  
Inductance  
change:  
Within  
Inductance  
change:  
Within  
step 2: Room temperature 2 to 3min.  
WithinM10%  
Qchange:  
step 3: Minimum operating temperature  
M20%  
M30%  
J0/K3C 30M3 min.  
WithinM30%  
step 4: Room temperature 2 to 3min.  
Number of cycles: 5  
Qchange:  
Within  
M30%  
Recovery: 2 to 3 hrs of recovery under the stan-  
dard condition after the test. (See Note 1)  
(Note 1) When there are questions concerning  
mesurement resultDmeasurement shall be made  
after 48M2 hrs of recovery under  
the standard condition.  
265  
4/4  
RELIABILITY DATA  
Multilayer chip inductors and beads  
Specified Value  
ARRAY  
Test Methods and Remarks  
Item  
BK0603 BK1005 BK1608 BK2125  
BKP1005 BKP1608 BKP2125 CK1608 CK2125 CKP3216 LK1005 LK1608 LK2125 HKQ0603 HK0603 HK1005 HK1608 HK2125  
BK2010 BK3216  
14. Damp Heat  
Appearance: No significant abnormality  
No  
mechanica  
damage.  
No  
No mechanica  
No  
No mechanica damage.  
mechanica Inductance change:  
damage. WithinM10%  
BK Series:  
mechanica damage.  
damage.  
fSteady stateg  
Temperature: 40M2C  
Impedance change: Within M30%  
Inductance change:  
Inductance WithinM10%  
Humidity: 90 to 95%RH  
+24  
Inductance  
change:  
Within  
Inductance Q change: WithinM20%  
Duration: 500K hrs  
0
change:  
Within  
M30%  
change:  
Within  
M10%  
Q change:  
WithinM30%  
Recovery: 2 to 3 hrs of recovery under the  
standard condition after the removal  
from test chamber.fSee Note1g  
M20%  
5
Q change:  
Within  
Q change:  
Within  
M30%  
M30%  
LK, CK, HK Series:  
Temperature: 40M2C (LK, CK Series)  
60M2C (HK Series)  
Humidity: 90 to 95%RH  
Duration: 500M12 hours  
Recovery: 2 to 3 hrs of recovery under the  
standard condition after the removal  
from test chamber. fSee Note1g  
BK Series:  
15.Loading under  
Damp Heat  
No  
mechanica  
damage.  
No  
No  
No  
No  
No mechanica damage.  
No mechanical damage, Inductance change  
mechanica mechanica mechanica mechanica Inductance change:  
damage. damage. damage. damage.  
Temperature: 40M2C (LK Series)  
withinM30L  
WithinM10%  
Humidity: 90 to 95%RH  
+24  
Inductance  
change:  
Within  
Inductance Inductance Inductance Inductance Q change: WithinM20%  
Duration: 500K hrs  
0
change:  
Within  
M30%  
change:  
Within  
M10%  
change:  
0.047 to  
12.0AH:  
Within  
change:  
Within  
M10%  
Applied current: Rated current  
M20%  
Recovery: 2 to 3 hrs of recovery under the  
standard condition after the removal  
from test chamber.fSee Note1g  
Q change:  
Within  
M30%  
Q change: M10%  
Q change:  
Within  
M30%  
Within  
15.0 to  
33.0AH:  
Within  
M15%  
M30%  
LK, CK, HK Series:  
Q change:  
Within  
M30%  
Temperature: 40M2C (LK, CK Series)  
60M2C (HK Series)  
Humidity: 90 to 95%RH  
Duration: 500M12 hrs  
Applied current: Rated current  
Recovery: 2 to 3 hrs of recovery under the  
standard condition after the removal  
from test chamber.  
fSee Note1g  
16.Loading at  
High  
Appearance: No significant abnormality  
No  
mechanica  
damage.  
No  
No  
No  
No  
No mechanica damage.  
BK Series:  
Temperature: 125M3C  
mechanica mechanica mechanica mechanica Inductance change:  
damage. damage. damage. damage.  
Impedance change: Within M30%  
WithinM10%  
Temperature  
Applied current: Rated current  
+24  
Inductance  
change:  
Within  
Inductance Inductance Inductance Inductance Q change: WithinM20%  
Duration: 500K hrs  
0
change:  
Within  
M30%  
change:  
Within  
M10%  
change:  
0.047 to  
12.0AH:  
Within  
change:  
Within  
M10%  
Recovery: 2 to 3 hrs of recovery under the  
standard condition after the removal  
from test chamber.fSee Note1g  
M20%  
Q change:  
Within  
M30%  
Q change: M10%  
Q change:  
Within  
M30%  
Within  
15.0 to  
33.0AH:  
Within  
M15%  
M30%  
LK, CK, HK Series, BK Series P type:  
Temperature: 85M2C (LK, CK Series)  
: 85M3C (BK Series P type)  
Q change:  
Within  
M30%  
: 85M2C (HK 1608, 2125)  
: 85M2C (HK 1005 operating  
temperature range K55 to J85C)  
: 125M2C (HKQ 0603,HK 0603, HK1005)  
operating temperature range  
K55 to 125C)  
J
Applied current: Rated current  
Duration: 500M12 hrs  
Recovery: 2 to 3 hrs of recovery under the  
standard condition after the removal  
from test chamber. fSee Note1g  
Note on standard condition: "standard condition" referred to herein is defined as follows:  
5 to 35C of temperature, 45 to 85% relative humidity, and 86 to 106kPa of air pressure.  
When there are questions concerning measurement results:  
(Note 1)  
measurement shall be made after 48M2 hrs of re-  
covery under the standard condition.  
In order to provide correlation data, the test shall be conducted under condition of 20M2C of temperature, 60 to 70% relative humidity,  
and 86 to 106kPa of air pressure. Unless otherwise specified, all the tests are conducted under the "standard condition."  
267  
1/7  
PRECAUTIONS  
Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer ferrite chip beads  
Stages  
Precautions  
Technical considerations  
1. Circuit Design  
SVerification of operating environment, electrical rating  
and performance  
1. A malfunction in medical equipment, spacecraft,  
nuclear reactors, etc. may cause serious harm to  
human life or have severe social ramifications. As  
such, any inductors to be used in such equipment may  
require higher safety and/or reliability considerations  
and should be clearly differentiated from components  
used in general purpose applications.  
5
SOperating Current (Verification of Rated current)  
1. The operating current for inductors must always be  
lower than their rated values.  
2. Do not apply current in excess of the rated value  
because the inductance may be reduced due to the  
magnetic saturation effect.  
2. PCB Design  
SPattern configurations  
1. The following diagrams and tables show some examples of recommended  
patterns to prevent excessive solder amounts (larger fillets which extend above  
the component end terminations). Examples of improper pattern designs are  
(Design of Land-patterns)  
1. When inductors are mounted on a PCB, the amount of  
solder used (size of fillet) can directly affect inductor  
performance. Therefore, the following items must be  
carefully considered in the design of solder land pat-  
terns:  
also shown.  
(1) Recommended land dimensions for a typical chip inductor land patterns for  
PCBs  
(1) The amount of solder applied can affect the ability of  
chips to withstand mechanical stresses which may lead  
to breaking or cracking. Therefore, when designing  
land-patterns it is necessary to consider the appropri-  
ate size and configuration of the solder pads which in  
turn determines the amount of solder necessary to form  
the fillets.  
Recommended land dimensions for wave-soldering (unit: mm)  
Type  
1608  
1.6  
2125  
2.0  
3216  
3.2  
L
(2) When more than one part is jointly soldered onto the  
same land or pad, the pad must be designed so that  
each component's soldering point is separated by sol-  
der-resist.  
W
0.8  
1.25  
1.6  
A
B
C
0.8V1.0  
0.5V0.8  
0.6V0.8  
1.0V1.4  
0.8V1.5  
0.9V1.2  
1.8V2.5  
0.8V1.7  
1.2V1.6  
Recommended land dimensions for reflow-soldering (unit: mm)  
Type  
0603  
0.6  
1005  
1.0  
1608  
1.6  
2125  
2.0  
3216  
3.2  
L
W
0.3  
0.5  
0.8  
1.25  
1.6  
A
B
C
0.20V0.30  
0.20V0.30  
0.25V0.40  
0.45V0.55  
0.40V0.50  
0.45V0.55  
0.6V0.8  
0.6V0.8  
0.6V0.8  
0.8V1.2  
0.8V1.2  
0.9V1.6  
1.8V2.5  
0.6V1.5  
1.2V2.0  
Excess solder can affect the ability of chips to withstand mechanical stresses.  
Therefore, please take proper precautions when designing land-patterns.  
Recommended land  
dimension for  
Reflow-soldering (unit: mm)  
3216  
3.2  
2010  
2.0  
L
W
1.6  
1.0  
a
b
c
d
0.7V0.9 0.5V0.6  
0.8V1.0 0.5V0.6  
0.4V0.5 0.2V0.3  
0.8  
0.5  
269  
2/7  
PRECAUTIONS  
Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer ferrite chip beads  
Stages  
2.PCB Design  
Precautions  
Technical considerations  
(2) Examples of good and bad solder application  
Not recommended  
Recommended  
Mixed mounting  
of SMD and  
leaded compo-  
nents  
C o m p o n e n t  
placement close  
to the chassis  
5
Hand-soldering  
of leaded com-  
ponents near  
mounted compo-  
nents  
Horizontal com-  
ponent place-  
ment  
1-1. The following are examples of good and bad inductor layout; SMD inductors  
should be located to minimize any possible mechanical stresses from board  
warp or deflection.  
SPattern configurations  
(Inductor layout on panelized [breakaway] PC boards)  
1. After inductors have been mounted on the boards, chips  
can be subjected to mechanical stresses in subsequent  
manufacturing processes (PCB cutting, board inspec-  
tion, mounting of additional parts, assembly into the  
chassis, wave soldering the reflow soldered boards etc.)  
For this reason, planning pattern configurations and  
the position of SMD inductors should be carefully per-  
formed to minimize stress.  
Not recommended  
Recommended  
Item  
Deflection of  
the board  
1-2. To layout the inductors for the breakaway PC board, it should be noted that  
the amount of mechanical stresses given will vary depending on inductor  
layout. An example below should be counted for better design.  
1-3. When breaking PC boards along their perforations, the amount of mechani-  
cal stress on the inductors can vary according to the method used. The  
following methods are listed in order from least stressful to most stressful:  
push-back, slit, V-grooving, and perforation. Thus, any ideal SMD inductor  
layout must also consider the PCB splitting procedure.  
271  
3/7  
PRECAUTIONS  
Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer ferrite chip beads  
Stages  
Precautions  
Technical considerations  
1. If the lower limit of the pick-up nozzle is low, too much force may be imposed  
on the inductors, causing damage. To avoid this, the following points should  
be considered before lowering the pick-up nozzle:  
3.Considerations for  
automatic placement  
SAdjustment of mounting machine  
1. Excessive impact load should not be imposed on the  
inductors when mounting onto the PC boards.  
2. The maintenance and inspection of the mounter should  
be conducted periodically.  
(1)The lower limit of the pick-up nozzle should be adjusted to the surface level of  
the PC board after correcting for deflection of the board.  
(2)The pick-up pressure should be adjusted between 1 and 3 N static loads.  
(3)To reduce the amount of deflection of the board caused by impact of the pick-  
up nozzle, supporting pins or back-up pins should be used under the PC board.  
The following diagrams show some typical examples of good pick-up nozzle  
placement:  
5
Improper method  
Proper method  
Single-sided mounting  
Double-sided  
mounting  
2. As the alignment pin wears out, adjustment of the nozzle height can cause  
chipping or cracking of the inductors because of mechanical impact on the  
inductors. To avoid this, the monitoring of the width between the alignment pin  
in the stopped position, and maintenance, inspection and replacement of the  
pin should be conducted periodically.  
SSelection of Adhesives  
1. Some adhesives may cause reduced insulation resistance. The difference  
between the shrinkage percentage of the adhesive and that of the inductors  
may result in stresses on the inductors and lead to cracking. Moreover, too  
little or too much adhesive applied to the board may adversely affect compo-  
nent placement, so the following precautions should be noted in the applica-  
tion of adhesives.  
1. Mounting inductors with adhesives in preliminary as-  
sembly, before the soldering stage, may lead to de-  
graded inductor characteristics unless the following  
factors are appropriately checked; the size of land pat-  
terns, type of adhesive, amount applied, hardening tem-  
perature and hardening period. Therefore, it is impera-  
tive to consult the manufacturer of the adhesives on  
proper usage and amounts of adhesive to use.  
(1)Required adhesive characteristics  
a. The adhesive should be strong enough to hold parts on the board during the  
mounting & solder process.  
b. The adhesive should have sufficient strength at high temperatures.  
c. The adhesive should have good coating and thickness consistency.  
d. The adhesive should be used during its prescribed shelf life.  
e. The adhesive should harden rapidly  
f. The adhesive must not be contaminated.  
g. The adhesive should have excellent insulation characteristics.  
h. The adhesive should not be toxic and have no emission of toxic gasses.  
273  
4/7  
PRECAUTIONS  
Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer ferrite chip beads  
Stages  
Precaution  
Technical considerations  
3.Considerations for  
automatic placement  
When using adhesives to mount inductors on a PCB, inappropriate amounts of  
adhesive on the board may adversely affect component placement. Too little  
adhesive may cause the inductors to fall off the board during the solder process.  
Too much adhesive may cause defective soldering due excessive flow of adhe-  
sive on to the land or solder pad.  
[Recommended conditions]  
Figure  
0805 case sizes as examples  
0.3mm min  
5
a
b
c
100 V120 Am  
Area with no adhesive  
4.Soldering  
SSelection of Flux  
1-1. When too much halogenated substance (Chlorine, etc.) content is used to  
activate the flux, or highly acidic flux is used, an excessive amount of resi-  
due after soldering may lead to corrosion of the terminal electrodes or deg-  
radation of insulation resistance on the surface of the Inductor.  
1-2. Flux is used to increase solderability in flow soldering, but if too much is  
applied, a large amount of flux gas may be emitted and may detrimentally  
affect solderability. To minimize the amount of flux applied, it is recom-  
mended to use a flux-bubbling system.  
1. Since flux may have a significant effect on the perfor-  
mance of inductors, it is necessary to verify the follow-  
ing conditions prior to use;  
(1)Flux used should be with less than or equal to 0.1 wt%  
(Chlorine conversion method) of halogenated content.  
Flux having a strong acidity content should not be ap-  
plied.  
(2)When soldering inductors on the board, the amount of  
flux applied should be controlled at the optimum level.  
(3)When using water-soluble flux, special care should be  
taken to properly clean the boards.  
1-3. Since the residue of water-soluble flux is easily dissolved by water content in  
the air, the residue on the surface of Inductor in high humidity conditions  
may cause a degradation of insulation resistance and therefore affect the  
reliability of the components. The cleaning methods and the capability of the  
machines used should also be considered carefully when selecting water-  
soluble flux.  
SSoldering  
Temperature, time, amount of solder, etc. are specified in  
accordance with the following recommended conditions.  
1-1. Preheating when soldering  
Heating: Chip inductor components should be preheated to within 100 to  
130C of the soldering. Cooling: The temperature difference between the  
components and cleaning process should not be greater than 100 C.  
Chip inductors are susceptible to thermal shock when exposed to rapid or  
concentrated heating or rapid cooling. Therefore, the soldering process  
must be conducted with a great care so as to prevent malfunction of the  
components due to excessive thermal shock.  
275  
5/7  
PRECAUTIONS  
Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer ferrite chip beads  
Stages  
4.Soldering  
Precautions  
Technical considerations  
SAnd please contact us about peak temperature when  
Recommended conditions for soldering  
you use lead-free paste.  
[Reflow soldering]  
Temperature profile  
TemperaturefCg  
fPb free solderingg  
300  
Peak 260C max  
10 sec max  
200  
100  
0
Gradually  
cooling  
Preheating  
150C  
60 sec min  
Heating above 230C  
40 sec max  
5
Ceramic chip components should be preheated to  
within 100 to 130C of the soldering.  
Assured to be reflow soldering for 2 times.  
Caution  
1. The ideal condition is to have solder mass (fillet) controlled to 1/2 to 1/3 of  
the thickness of the inductor, as shown below:  
2. Because excessive dwell times can detrimentally affect solderability, sol-  
dering duration should be kept as close to recommended times as pos-  
sible.  
[Wave soldering]  
TemperaturefCg  
300  
fPb free solderingg  
Temperature profile  
Peak 260C max  
10 sec max  
200  
100  
0
Gradually  
cooling  
Preheating  
150C  
120 sec min  
Ceramic chip components should be preheated to  
within 100 to 130C of the soldering.  
Assured to be wave soldering for 1 time.  
Except for reflow soldering type.  
Caution  
1. Make sure the inductors are preheated sufficiently.  
2. The temperature difference between the inductor and melted solder should  
not be greater than 100 to 130C  
3. Cooling after soldering should be as gradual as possible.  
4. Wave soldering must not be applied to the inductors designated as for reflow  
soldering only.  
[Hand soldering]  
Temperature profile  
TemperaturefCg  
fPb free solderingg  
400  
350C max  
3 sec max  
300  
200  
Gradually  
cooling  
⊿T�  
100  
0
60 sec min  
f※⊿TT190C f3216Type maxg, ⊿TT130C f3225  
Type mingg  
It is recommended to use 20W soldering iron and  
the tip is 1B or less.  
The soldering iron should not directly touch the  
components.  
Assured to be soldering iron for 1 time.  
Note: The above profiles are the maximum allowable  
soldering condition, therefore these profiles are  
not always recommended.  
Caution  
1. Use a 20W soldering iron with a maximum tip diameter of 1.0 mm.  
2. The soldering iron should not directly touch the inductor.  
5.Cleaning  
SCleaning conditions  
1. The use of inappropriate solutions can cause foreign substances such as flux  
residue to adhere to the inductor, resulting in a degradation of the inductor's  
electrical properties (especially insulation resistance).  
1. When cleaning the PC board after the Inductors are all  
mounted, select the appropriate cleaning solution ac-  
cording to the type of flux used and purpose of the  
cleaning (e.g. to remove soldering flux or other materi-  
als from the production process.)  
277  
6/7  
PRECAUTIONS  
Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer ferrite chip beads  
Stages  
5.Cleaning  
Precautions  
Technical considerations  
2. Inappropriate cleaning conditions (insufficient or excessive cleaning) may  
detrimentally affect the performance of the inductors.  
2. Cleaning conditions should be determined after verify-  
ing, through a test run, that the cleaning process does  
not affect the inductor's characteristics.  
(1)Excessive cleaning  
In the case of ultrasonic cleaning, too much power output can cause  
excessive vibration of the PC board which may lead to the cracking of the  
inductor or the soldered portion, or decrease the terminal electrodes' strength.  
Thus the following conditions should be carefully checked;  
5
Ultrasonic output  
Below 20 w/b  
Ultrasonic frequency  
Below 40 kHz  
Ultrasonic washing period 5 min. or less  
SApplication of resin coatings, moldings, etc. to the PCB  
6. Post cleaning processes  
and components.  
1. With some type of resins a decomposition gas or chemi-  
cal reaction vapor may remain inside the resin during  
the hardening period or while left under normal storage  
conditions resulting in the deterioration of the inductor's  
performance.  
2. When a resin's hardening temperature is higher than  
the inductor's operating temperature, the stresses gen-  
erated by the excess heat may lead to inductor dam-  
age or destruction.  
3. Stress caused by a resin’s temperature generated ex-  
pansion and contraction may damage inductors.  
The use of such resins, molding materials etc. is not rec-  
ommended.  
7. Handling  
SBreakaway PC boards (splitting along perforations)  
1. When splitting the PC board after mounting inductors  
and other components, care is required so as not to  
give any stresses of deflection or twisting to the board.  
2. Board separation should not be done manually, but by  
using the appropriate devices.  
SGeneral handling precautions  
1. Always wear static control bands to protect against ESD.  
2. Keep the inductors away from all magnets and mag-  
netic objects.  
3. Use non-magnetic tweezers when handling inductors.  
4. Any devices used with the inductors (soldering irons,  
measuring instruments) should be properly grounded.  
5. Keep bare hands and metal products (i.e., metal desk)  
away from chip electrodes or conductive areas that lead  
to chip electrodes.  
6. Keep inductors away from items that generate mag-  
netic fields such as speakers or coils.  
SMechanical considerations  
1. Be careful not to subject the inductors to excessive  
mechanical shocks.  
(1) If inductors are dropped on the floor or a hard surface  
they should not be used.  
(2)When handling the mounted boards, be careful that  
the mounted components do not come in contact with  
or bump against other boards or components.  
279  
7/7  
PRECAUTIONS  
Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer ferrite chip beads  
Stages  
Precautions  
Technical considerations  
8. Storage conditions  
SStorage  
1. If the parts are stocked in a high temperature and humidity environment, prob-  
lems such as reduced solderability caused by oxidation of terminal electrodes  
and deterioration of taping/packaging materials may take place. For this rea-  
son, components should be used within 6 months from the time of delivery. If  
exceeding the above period, please check solderability before using the in-  
ductors  
1. To maintain the solderability of terminal electrodes and  
to keep the packaging material in good condition, care  
must be taken to control temperature and humidity in  
the storage area. Humidity should especially be kept  
as low as possible.  
Recommended conditions  
Ambient temperature  
Humidity  
Below 40 C  
5
Below 70% RH  
The ambient temperature must be kept below 30 C. Even  
under ideal storage conditions inductor electrode solder-  
ability decreases as time passes, so inductors should be  
used within 6 months from the time of delivery.  
*The packaging material should be kept where no chlo-  
rine or sulfur exists in the air.  
281  

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LGHK10058N2J-T

General Purpose Inductor, 0.0082uH, 5%, 1 Element, Ferrite-Core, SMD, 0402, CHIP, 0402, HALOGEN FREE AND ROHS COMPLIANT
TAIYO YUDEN

LGHK10058N2K

General Purpose Inductor, 0.0082uH, 10%, 1 Element, Ferrite-Core, SMD
TAIYO YUDEN

LGHK10058N2S

General Purpose Inductor, 0.0082uH, 3.659%, 1 Element, Ceramic-Core, SMD,
TAIYO YUDEN

LGHK10058N2S-T

General Purpose Inductor, 0.0082uH, 3.659%, 1 Element, Ferrite-Core, SMD,
TAIYO YUDEN

LGHK1005R10J

General Purpose Inductor, 0.1uH, 5%, 1 Element, Ferrite-Core, SMD, 0402, CHIP, 0402, ROHS COMPLIANT
TAIYO YUDEN